Embossing and laminating irregular bonding patterns
Webs can be embossed and laminated using irregular bonding patterns with the pin-on-pin embossing process. Different patterns are provided onto each web and the webs are joined in a bonding nip to form a laminate. The bonding pattern formed in the bonding nip is irregular. The irregularity of the bo...
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| creator | BERNHARDT E. KRESSNER JAMES JAY TANNER WALTER T. SCHULTZ DAVID G. BIGGS MARK D. PERKINS WILLIAM J. RAYNOR JR |
| description | Webs can be embossed and laminated using irregular bonding patterns with the pin-on-pin embossing process. Different patterns are provided onto each web and the webs are joined in a bonding nip to form a laminate. The bonding pattern formed in the bonding nip is irregular. The irregularity of the bonding pattern reduces vibrations within the machinery and allows increased machine speed. The irregularity of the pattern can be determined using the Self-Similarity Count or the Energy Suppression Factor method. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_AU752281BB2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>AU752281BB2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_AU752281BB23</originalsourceid><addsrcrecordid>eNrjZDB2zU3KLy7OzEtXSMxLUchJzM3MSywBcTOLilLTS3MSixSS8vNSQCIFiSUlqUV5xTwMrGmJOcWpvFCam0HBzTXE2UM3tSA_PrW4IDE5NS-1JN4x1NzUyMjC0MnJyJgIJQDWPiyb</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Embossing and laminating irregular bonding patterns</title><source>esp@cenet</source><creator>BERNHARDT E. KRESSNER ; JAMES JAY TANNER ; WALTER T. SCHULTZ ; DAVID G. BIGGS ; MARK D. PERKINS ; WILLIAM J. RAYNOR JR</creator><creatorcontrib>BERNHARDT E. KRESSNER ; JAMES JAY TANNER ; WALTER T. SCHULTZ ; DAVID G. BIGGS ; MARK D. PERKINS ; WILLIAM J. RAYNOR JR</creatorcontrib><description>Webs can be embossed and laminated using irregular bonding patterns with the pin-on-pin embossing process. Different patterns are provided onto each web and the webs are joined in a bonding nip to form a laminate. The bonding pattern formed in the bonding nip is irregular. The irregularity of the bonding pattern reduces vibrations within the machinery and allows increased machine speed. The irregularity of the pattern can be determined using the Self-Similarity Count or the Energy Suppression Factor method.</description><edition>7</edition><language>eng</language><subject>MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER ; MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD ORMATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER ; PERFORMING OPERATIONS ; TRANSPORTING ; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER</subject><creationdate>2002</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020912&DB=EPODOC&CC=AU&NR=752281B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20020912&DB=EPODOC&CC=AU&NR=752281B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>BERNHARDT E. KRESSNER</creatorcontrib><creatorcontrib>JAMES JAY TANNER</creatorcontrib><creatorcontrib>WALTER T. SCHULTZ</creatorcontrib><creatorcontrib>DAVID G. BIGGS</creatorcontrib><creatorcontrib>MARK D. PERKINS</creatorcontrib><creatorcontrib>WILLIAM J. RAYNOR JR</creatorcontrib><title>Embossing and laminating irregular bonding patterns</title><description>Webs can be embossed and laminated using irregular bonding patterns with the pin-on-pin embossing process. Different patterns are provided onto each web and the webs are joined in a bonding nip to form a laminate. The bonding pattern formed in the bonding nip is irregular. The irregularity of the bonding pattern reduces vibrations within the machinery and allows increased machine speed. The irregularity of the pattern can be determined using the Self-Similarity Count or the Energy Suppression Factor method.</description><subject>MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER</subject><subject>MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD ORMATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER</subject><subject>PERFORMING OPERATIONS</subject><subject>TRANSPORTING</subject><subject>WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2002</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB2zU3KLy7OzEtXSMxLUchJzM3MSywBcTOLilLTS3MSixSS8vNSQCIFiSUlqUV5xTwMrGmJOcWpvFCam0HBzTXE2UM3tSA_PrW4IDE5NS-1JN4x1NzUyMjC0MnJyJgIJQDWPiyb</recordid><startdate>20020912</startdate><enddate>20020912</enddate><creator>BERNHARDT E. KRESSNER</creator><creator>JAMES JAY TANNER</creator><creator>WALTER T. SCHULTZ</creator><creator>DAVID G. BIGGS</creator><creator>MARK D. PERKINS</creator><creator>WILLIAM J. RAYNOR JR</creator><scope>EVB</scope></search><sort><creationdate>20020912</creationdate><title>Embossing and laminating irregular bonding patterns</title><author>BERNHARDT E. KRESSNER ; JAMES JAY TANNER ; WALTER T. SCHULTZ ; DAVID G. BIGGS ; MARK D. PERKINS ; WILLIAM J. RAYNOR JR</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_AU752281BB23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2002</creationdate><topic>MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER</topic><topic>MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD ORMATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER</topic><topic>PERFORMING OPERATIONS</topic><topic>TRANSPORTING</topic><topic>WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER</topic><toplevel>online_resources</toplevel><creatorcontrib>BERNHARDT E. KRESSNER</creatorcontrib><creatorcontrib>JAMES JAY TANNER</creatorcontrib><creatorcontrib>WALTER T. SCHULTZ</creatorcontrib><creatorcontrib>DAVID G. BIGGS</creatorcontrib><creatorcontrib>MARK D. PERKINS</creatorcontrib><creatorcontrib>WILLIAM J. RAYNOR JR</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>BERNHARDT E. KRESSNER</au><au>JAMES JAY TANNER</au><au>WALTER T. SCHULTZ</au><au>DAVID G. BIGGS</au><au>MARK D. PERKINS</au><au>WILLIAM J. RAYNOR JR</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Embossing and laminating irregular bonding patterns</title><date>2002-09-12</date><risdate>2002</risdate><abstract>Webs can be embossed and laminated using irregular bonding patterns with the pin-on-pin embossing process. Different patterns are provided onto each web and the webs are joined in a bonding nip to form a laminate. The bonding pattern formed in the bonding nip is irregular. The irregularity of the bonding pattern reduces vibrations within the machinery and allows increased machine speed. The irregularity of the pattern can be determined using the Self-Similarity Count or the Energy Suppression Factor method.</abstract><edition>7</edition><oa>free_for_read</oa></addata></record> |
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| subjects | MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER MECHANICAL WORKING OR DEFORMATION OF PAPER, CARDBOARD ORMATERIAL WORKED IN A MANNER ANALOGOUS TO PAPER PERFORMING OPERATIONS TRANSPORTING WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER |
| title | Embossing and laminating irregular bonding patterns |
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