COOLING ASSEMBLY FOR HIGH POWER SEMI-CONDUCTOR ELEMENTS
In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block.
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | CHIAKI NONAKA TAKASHI YOSHIDA HIROSHI ARII HIROHITO KAWADAM |
| description | In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_AU500226BB2</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>AU500226BB2</sourcerecordid><originalsourceid>FETCH-epo_espacenet_AU500226BB23</originalsourceid><addsrcrecordid>eNrjZDB39vf38fRzV3AMDnb1dfKJVHDzD1Lw8HT3UAjwD3cNUgCKeuo6-_u5hDqHAGVcfVx9Xf1CgnkYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSbxjqKmBgZGRmZOTkTERSgD3ZCf2</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>COOLING ASSEMBLY FOR HIGH POWER SEMI-CONDUCTOR ELEMENTS</title><source>esp@cenet</source><creator>CHIAKI NONAKA ; TAKASHI YOSHIDA ; HIROSHI ARII ; HIROHITO KAWADAM</creator><creatorcontrib>CHIAKI NONAKA ; TAKASHI YOSHIDA ; HIROSHI ARII ; HIROHITO KAWADAM</creatorcontrib><description>In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>1979</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19790517&DB=EPODOC&CC=AU&NR=500226B2$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19790517&DB=EPODOC&CC=AU&NR=500226B2$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHIAKI NONAKA</creatorcontrib><creatorcontrib>TAKASHI YOSHIDA</creatorcontrib><creatorcontrib>HIROSHI ARII</creatorcontrib><creatorcontrib>HIROHITO KAWADAM</creatorcontrib><title>COOLING ASSEMBLY FOR HIGH POWER SEMI-CONDUCTOR ELEMENTS</title><description>In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1979</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB39vf38fRzV3AMDnb1dfKJVHDzD1Lw8HT3UAjwD3cNUgCKeuo6-_u5hDqHAGVcfVx9Xf1CgnkYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSbxjqKmBgZGRmZOTkTERSgD3ZCf2</recordid><startdate>19790517</startdate><enddate>19790517</enddate><creator>CHIAKI NONAKA</creator><creator>TAKASHI YOSHIDA</creator><creator>HIROSHI ARII</creator><creator>HIROHITO KAWADAM</creator><scope>EVB</scope></search><sort><creationdate>19790517</creationdate><title>COOLING ASSEMBLY FOR HIGH POWER SEMI-CONDUCTOR ELEMENTS</title><author>CHIAKI NONAKA ; TAKASHI YOSHIDA ; HIROSHI ARII ; HIROHITO KAWADAM</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_AU500226BB23</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>1979</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHIAKI NONAKA</creatorcontrib><creatorcontrib>TAKASHI YOSHIDA</creatorcontrib><creatorcontrib>HIROSHI ARII</creatorcontrib><creatorcontrib>HIROHITO KAWADAM</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHIAKI NONAKA</au><au>TAKASHI YOSHIDA</au><au>HIROSHI ARII</au><au>HIROHITO KAWADAM</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>COOLING ASSEMBLY FOR HIGH POWER SEMI-CONDUCTOR ELEMENTS</title><date>1979-05-17</date><risdate>1979</risdate><abstract>In a cooling assembly including a heat conductive block mounting an electronic part, and a heat pipe attached to the heat conductive block, a connector connected to the leads of the electronic part is arranged in the heat conductive block.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng |
| recordid | cdi_epo_espacenet_AU500226BB2 |
| source | esp@cenet |
| subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS |
| title | COOLING ASSEMBLY FOR HIGH POWER SEMI-CONDUCTOR ELEMENTS |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-05T10%3A16%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHIAKI%20NONAKA&rft.date=1979-05-17&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EAU500226BB2%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |