Substrate with deposition and/or friction reduction coating

The present disclosure may be directed towards a substrate with an array disposed thereon. The substrate comprising a bonding array with a plurality of bonding locations. A low emissivity layer is deposited on at least one side of the substrate and covers at least some of the bonding locations. The...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: HUSSEY, Thomas, WHITBY, Scott
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:The present disclosure may be directed towards a substrate with an array disposed thereon. The substrate comprising a bonding array with a plurality of bonding locations. A low emissivity layer is deposited on at least one side of the substrate and covers at least some of the bonding locations. The low emissivity layer may be a metal layer which functions as a radiant barrier.