Packaging technique for inductive conductivity sensors

This invention presents a new packaging technique that allows for the use of a wider range of isolating materials for inductive conductivity sensors, thereby significantly reducing the cost of producing the sensors, improving their precision and accuracy, and increasing their sensitivity.

Bibliographische Detailangaben

1. Verfasser:	REZANEZHAD GATABI, Javad
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRICITY INDUCTANCES INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MAGNETS MEASURING PHYSICS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TESTING TRANSFORMERS
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