Sealing lid formed from translucent material

The present invention pertains to a sealing lid for an optical element package in which a translucent material such as glass capable of transmitting visible light or the like is used. The present invention includes a lid body formed from a translucent material, and the lid body is provided with a ju...

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Hauptverfasser: KUDO, Noriyuki, KUSAMORI, Hiroyuki, TANAKA, Katsunao, IRIBE, Takeshi, SHIMADA, Tomohiro
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creator KUDO, Noriyuki
KUSAMORI, Hiroyuki
TANAKA, Katsunao
IRIBE, Takeshi
SHIMADA, Tomohiro
description The present invention pertains to a sealing lid for an optical element package in which a translucent material such as glass capable of transmitting visible light or the like is used. The present invention includes a lid body formed from a translucent material, and the lid body is provided with a junction region having a frame shape corresponding to the outer peripheral shape of the lid body. A brazing material comprising a plurality of eutectic alloy pieces is fused on the junction region of the lid body. Examples of the arrangement state of the brazing material include spherical brazing materials arranged in a contiguous manner on the frame shape along the junction region.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_AU2019222263A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>AU2019222263A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_AU2019222263A13</originalsourceid><addsrcrecordid>eNrjZNAJTk3MycxLV8jJTFFIyy_KTQVSRfm5CiVFiXnFOaXJqXklCrmJJalFmYk5PAysaYk5xam8UJqbQdnNNcTZQze1ID8-tbggEag6tSTeMdTIwNDSCAjMjB0NjYlTBQA85yqs</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Sealing lid formed from translucent material</title><source>esp@cenet</source><creator>KUDO, Noriyuki ; KUSAMORI, Hiroyuki ; TANAKA, Katsunao ; IRIBE, Takeshi ; SHIMADA, Tomohiro</creator><creatorcontrib>KUDO, Noriyuki ; KUSAMORI, Hiroyuki ; TANAKA, Katsunao ; IRIBE, Takeshi ; SHIMADA, Tomohiro</creatorcontrib><description>The present invention pertains to a sealing lid for an optical element package in which a translucent material such as glass capable of transmitting visible light or the like is used. The present invention includes a lid body formed from a translucent material, and the lid body is provided with a junction region having a frame shape corresponding to the outer peripheral shape of the lid body. A brazing material comprising a plurality of eutectic alloy pieces is fused on the junction region of the lid body. Examples of the arrangement state of the brazing material include spherical brazing materials arranged in a contiguous manner on the frame shape along the junction region.</description><language>eng</language><subject>ALLOYS ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200924&amp;DB=EPODOC&amp;CC=AU&amp;NR=2019222263A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200924&amp;DB=EPODOC&amp;CC=AU&amp;NR=2019222263A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUDO, Noriyuki</creatorcontrib><creatorcontrib>KUSAMORI, Hiroyuki</creatorcontrib><creatorcontrib>TANAKA, Katsunao</creatorcontrib><creatorcontrib>IRIBE, Takeshi</creatorcontrib><creatorcontrib>SHIMADA, Tomohiro</creatorcontrib><title>Sealing lid formed from translucent material</title><description>The present invention pertains to a sealing lid for an optical element package in which a translucent material such as glass capable of transmitting visible light or the like is used. The present invention includes a lid body formed from a translucent material, and the lid body is provided with a junction region having a frame shape corresponding to the outer peripheral shape of the lid body. A brazing material comprising a plurality of eutectic alloy pieces is fused on the junction region of the lid body. Examples of the arrangement state of the brazing material include spherical brazing materials arranged in a contiguous manner on the frame shape along the junction region.</description><subject>ALLOYS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNAJTk3MycxLV8jJTFFIyy_KTQVSRfm5CiVFiXnFOaXJqXklCrmJJalFmYk5PAysaYk5xam8UJqbQdnNNcTZQze1ID8-tbggEag6tSTeMdTIwNDSCAjMjB0NjYlTBQA85yqs</recordid><startdate>20200924</startdate><enddate>20200924</enddate><creator>KUDO, Noriyuki</creator><creator>KUSAMORI, Hiroyuki</creator><creator>TANAKA, Katsunao</creator><creator>IRIBE, Takeshi</creator><creator>SHIMADA, Tomohiro</creator><scope>EVB</scope></search><sort><creationdate>20200924</creationdate><title>Sealing lid formed from translucent material</title><author>KUDO, Noriyuki ; KUSAMORI, Hiroyuki ; TANAKA, Katsunao ; IRIBE, Takeshi ; SHIMADA, Tomohiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_AU2019222263A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>ALLOYS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>KUDO, Noriyuki</creatorcontrib><creatorcontrib>KUSAMORI, Hiroyuki</creatorcontrib><creatorcontrib>TANAKA, Katsunao</creatorcontrib><creatorcontrib>IRIBE, Takeshi</creatorcontrib><creatorcontrib>SHIMADA, Tomohiro</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUDO, Noriyuki</au><au>KUSAMORI, Hiroyuki</au><au>TANAKA, Katsunao</au><au>IRIBE, Takeshi</au><au>SHIMADA, Tomohiro</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Sealing lid formed from translucent material</title><date>2020-09-24</date><risdate>2020</risdate><abstract>The present invention pertains to a sealing lid for an optical element package in which a translucent material such as glass capable of transmitting visible light or the like is used. The present invention includes a lid body formed from a translucent material, and the lid body is provided with a junction region having a frame shape corresponding to the outer peripheral shape of the lid body. A brazing material comprising a plurality of eutectic alloy pieces is fused on the junction region of the lid body. Examples of the arrangement state of the brazing material include spherical brazing materials arranged in a contiguous manner on the frame shape along the junction region.</abstract><oa>free_for_read</oa></addata></record>
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subjects ALLOYS
BASIC ELECTRIC ELEMENTS
CHEMISTRY
CLADDING OR PLATING BY SOLDERING OR WELDING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FERROUS OR NON-FERROUS ALLOYS
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
METALLURGY
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
SOLDERING OR UNSOLDERING
TRANSPORTING
TREATMENT OF ALLOYS OR NON-FERROUS METALS
WELDING
WORKING BY LASER BEAM
title Sealing lid formed from translucent material
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