Computing system with superconducting and non-superconducting components located on a common substrate

A computing system including a common substrate having both superconducting components and non-superconducting components is provided. The superconducting components may be attached towards a first end of the common substrate and the non-superconducting components may be attached towards a second en...

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Hauptverfasser: CHOROSINSKI, Leonard G, HEFFNER, Harlan C, WAKAMIYA, Stanley K, CHRISTIANSEN, Martin B
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creator CHOROSINSKI, Leonard G
HEFFNER, Harlan C
WAKAMIYA, Stanley K
CHRISTIANSEN, Martin B
description A computing system including a common substrate having both superconducting components and non-superconducting components is provided. The superconducting components may be attached towards a first end of the common substrate and the non-superconducting components may be attached towards a second end, opposite to the first end, of the common substrate. The common substrate may include circuit traces for interconnecting the superconducting components with the non-superconducting components. A heat-shield may thermally separate the first end from the second end of the common substrate such that the superconducting components are configured to operate in a temperature range between 2 Kelvin to 77 Kelvin and the non-superconducting components are configured to operate in a temperature range between 200 Kelvin to 400 Kelvin. Each of the superconducting components may be configured to provide primarily a processor functionality and each of the non-superconducting components may be configured to provide primarily a storage functionality.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_AU2018413356A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>AU2018413356A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_AU2018413356A13</originalsourceid><addsrcrecordid>eNqNi7EKwkAQRNNYiPoPC9YBz1OxDUHxA7QO591GA7ndI7uH-PdGsbKymuG9mWnR1hxT1o5uIE9RjPDo9A6SEw6eKWT_cY4CEFP5y_34ZkJSgZ69UwzABO7N41gkX0WHEc-LSet6wcU3Z8XyeDjXpxITNyjJeSTUprqsV2a_MdZud5Wx_61ePfpBwQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Computing system with superconducting and non-superconducting components located on a common substrate</title><source>esp@cenet</source><creator>CHOROSINSKI, Leonard G ; HEFFNER, Harlan C ; WAKAMIYA, Stanley K ; CHRISTIANSEN, Martin B</creator><creatorcontrib>CHOROSINSKI, Leonard G ; HEFFNER, Harlan C ; WAKAMIYA, Stanley K ; CHRISTIANSEN, Martin B</creatorcontrib><description>A computing system including a common substrate having both superconducting components and non-superconducting components is provided. The superconducting components may be attached towards a first end of the common substrate and the non-superconducting components may be attached towards a second end, opposite to the first end, of the common substrate. The common substrate may include circuit traces for interconnecting the superconducting components with the non-superconducting components. A heat-shield may thermally separate the first end from the second end of the common substrate such that the superconducting components are configured to operate in a temperature range between 2 Kelvin to 77 Kelvin and the non-superconducting components are configured to operate in a temperature range between 200 Kelvin to 400 Kelvin. Each of the superconducting components may be configured to provide primarily a processor functionality and each of the non-superconducting components may be configured to provide primarily a storage functionality.</description><language>eng</language><subject>CALCULATING ; COMPUTING ; COUNTING ; ELECTRIC DIGITAL DATA PROCESSING ; ELECTRICITY ; PHYSICS</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200820&amp;DB=EPODOC&amp;CC=AU&amp;NR=2018413356A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20200820&amp;DB=EPODOC&amp;CC=AU&amp;NR=2018413356A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHOROSINSKI, Leonard G</creatorcontrib><creatorcontrib>HEFFNER, Harlan C</creatorcontrib><creatorcontrib>WAKAMIYA, Stanley K</creatorcontrib><creatorcontrib>CHRISTIANSEN, Martin B</creatorcontrib><title>Computing system with superconducting and non-superconducting components located on a common substrate</title><description>A computing system including a common substrate having both superconducting components and non-superconducting components is provided. The superconducting components may be attached towards a first end of the common substrate and the non-superconducting components may be attached towards a second end, opposite to the first end, of the common substrate. The common substrate may include circuit traces for interconnecting the superconducting components with the non-superconducting components. A heat-shield may thermally separate the first end from the second end of the common substrate such that the superconducting components are configured to operate in a temperature range between 2 Kelvin to 77 Kelvin and the non-superconducting components are configured to operate in a temperature range between 200 Kelvin to 400 Kelvin. Each of the superconducting components may be configured to provide primarily a processor functionality and each of the non-superconducting components may be configured to provide primarily a storage functionality.</description><subject>CALCULATING</subject><subject>COMPUTING</subject><subject>COUNTING</subject><subject>ELECTRIC DIGITAL DATA PROCESSING</subject><subject>ELECTRICITY</subject><subject>PHYSICS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNi7EKwkAQRNNYiPoPC9YBz1OxDUHxA7QO591GA7ndI7uH-PdGsbKymuG9mWnR1hxT1o5uIE9RjPDo9A6SEw6eKWT_cY4CEFP5y_34ZkJSgZ69UwzABO7N41gkX0WHEc-LSet6wcU3Z8XyeDjXpxITNyjJeSTUprqsV2a_MdZud5Wx_61ePfpBwQ</recordid><startdate>20200820</startdate><enddate>20200820</enddate><creator>CHOROSINSKI, Leonard G</creator><creator>HEFFNER, Harlan C</creator><creator>WAKAMIYA, Stanley K</creator><creator>CHRISTIANSEN, Martin B</creator><scope>EVB</scope></search><sort><creationdate>20200820</creationdate><title>Computing system with superconducting and non-superconducting components located on a common substrate</title><author>CHOROSINSKI, Leonard G ; HEFFNER, Harlan C ; WAKAMIYA, Stanley K ; CHRISTIANSEN, Martin B</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_AU2018413356A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2020</creationdate><topic>CALCULATING</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRICITY</topic><topic>PHYSICS</topic><toplevel>online_resources</toplevel><creatorcontrib>CHOROSINSKI, Leonard G</creatorcontrib><creatorcontrib>HEFFNER, Harlan C</creatorcontrib><creatorcontrib>WAKAMIYA, Stanley K</creatorcontrib><creatorcontrib>CHRISTIANSEN, Martin B</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHOROSINSKI, Leonard G</au><au>HEFFNER, Harlan C</au><au>WAKAMIYA, Stanley K</au><au>CHRISTIANSEN, Martin B</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Computing system with superconducting and non-superconducting components located on a common substrate</title><date>2020-08-20</date><risdate>2020</risdate><abstract>A computing system including a common substrate having both superconducting components and non-superconducting components is provided. The superconducting components may be attached towards a first end of the common substrate and the non-superconducting components may be attached towards a second end, opposite to the first end, of the common substrate. The common substrate may include circuit traces for interconnecting the superconducting components with the non-superconducting components. A heat-shield may thermally separate the first end from the second end of the common substrate such that the superconducting components are configured to operate in a temperature range between 2 Kelvin to 77 Kelvin and the non-superconducting components are configured to operate in a temperature range between 200 Kelvin to 400 Kelvin. Each of the superconducting components may be configured to provide primarily a processor functionality and each of the non-superconducting components may be configured to provide primarily a storage functionality.</abstract><oa>free_for_read</oa></addata></record>
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subjects CALCULATING
COMPUTING
COUNTING
ELECTRIC DIGITAL DATA PROCESSING
ELECTRICITY
PHYSICS
title Computing system with superconducting and non-superconducting components located on a common substrate
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T05%3A24%3A01IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=CHOROSINSKI,%20Leonard%20G&rft.date=2020-08-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EAU2018413356A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true