Biodegradable hot melt adhesives

The present disclosure provides a hot melt adhesive which includes at least the following components: (1) from about 10 to about 20 weight percent of a lactic acid oligomer or polymer having a weight average molecular weight from about 1500 to about 3000; (2) from about 40 to about 75 weight percent...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Carraway, Daniel, Grubbs III, Joe B, Wann, Steven, Arnold, Rachelle
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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