METHOD OF BONDING A PIEZOELECTRIC MATERIAL AND A SUBSTRATE

A method of bonding a piezoelectric material and a substrate having a melting point TSUB comprises the steps of: a) depositing a layer of a first metallic material (M1) having a melting point T1 on a bonding surface of the piezoelectric material; b) depositing a layer of the first metallic material...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DMITRY GENNADIEVICH GROMOV, YURY NIKOLAEVICH KORKISHKO, VYACHESLOAV ALEXANDROVICH FEDOROV, SERGEI ALEXANDROVICH GAVRILOV, VIKTOR BORISOVICH YAKOVLEV
Format:	Patent
Sprache:	eng
Schlagworte:	ELECTRICITY
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