RETAINING AND HEAT DISSIPATING STRUCTURE FOR ELECTRONIC EQUIPMENT

A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder ( 7 ), possibly mixed with a lightening material ( 8 ), placed with a certain degree of compression inside a container housing the printed circuit boards ( 1 )...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: MARIO BISERNI, FABRIZIO BOER
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator MARIO BISERNI
FABRIZIO BOER
description A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder ( 7 ), possibly mixed with a lightening material ( 8 ), placed with a certain degree of compression inside a container housing the printed circuit boards ( 1 ) carrying the equipment components ( 2 ).
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_AU2003223066A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>AU2003223066A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_AU2003223066A13</originalsourceid><addsrcrecordid>eNrjZHAMcg1x9PTz9HNXcPRzUfBwdQxRcPEMDvYMcAwBCQaHBIU6h4QGuSq4-QcpuPq4OocE-ft5Oiu4BoZ6Bvi6-oXwMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JJ4x1AjAwNjIyNjAzMzR0Nj4lQBAJmhK_U</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RETAINING AND HEAT DISSIPATING STRUCTURE FOR ELECTRONIC EQUIPMENT</title><source>esp@cenet</source><creator>MARIO BISERNI ; FABRIZIO BOER</creator><creatorcontrib>MARIO BISERNI ; FABRIZIO BOER</creatorcontrib><description>A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder ( 7 ), possibly mixed with a lightening material ( 8 ), placed with a certain degree of compression inside a container housing the printed circuit boards ( 1 ) carrying the equipment components ( 2 ).</description><edition>7</edition><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2003</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20031202&amp;DB=EPODOC&amp;CC=AU&amp;NR=2003223066A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20031202&amp;DB=EPODOC&amp;CC=AU&amp;NR=2003223066A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MARIO BISERNI</creatorcontrib><creatorcontrib>FABRIZIO BOER</creatorcontrib><title>RETAINING AND HEAT DISSIPATING STRUCTURE FOR ELECTRONIC EQUIPMENT</title><description>A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder ( 7 ), possibly mixed with a lightening material ( 8 ), placed with a certain degree of compression inside a container housing the printed circuit boards ( 1 ) carrying the equipment components ( 2 ).</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2003</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAMcg1x9PTz9HNXcPRzUfBwdQxRcPEMDvYMcAwBCQaHBIU6h4QGuSq4-QcpuPq4OocE-ft5Oiu4BoZ6Bvi6-oXwMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JJ4x1AjAwNjIyNjAzMzR0Nj4lQBAJmhK_U</recordid><startdate>20031202</startdate><enddate>20031202</enddate><creator>MARIO BISERNI</creator><creator>FABRIZIO BOER</creator><scope>EVB</scope></search><sort><creationdate>20031202</creationdate><title>RETAINING AND HEAT DISSIPATING STRUCTURE FOR ELECTRONIC EQUIPMENT</title><author>MARIO BISERNI ; FABRIZIO BOER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_AU2003223066A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2003</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>MARIO BISERNI</creatorcontrib><creatorcontrib>FABRIZIO BOER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MARIO BISERNI</au><au>FABRIZIO BOER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RETAINING AND HEAT DISSIPATING STRUCTURE FOR ELECTRONIC EQUIPMENT</title><date>2003-12-02</date><risdate>2003</risdate><abstract>A retaining and heat dissipating structure for electronic equipments installed aboard space, air or land vehicles comprises a ceramic powder ( 7 ), possibly mixed with a lightening material ( 8 ), placed with a certain degree of compression inside a container housing the printed circuit boards ( 1 ) carrying the equipment components ( 2 ).</abstract><edition>7</edition><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_AU2003223066A1
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title RETAINING AND HEAT DISSIPATING STRUCTURE FOR ELECTRONIC EQUIPMENT
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T13%3A31%3A56IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MARIO%20BISERNI&rft.date=2003-12-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EAU2003223066A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true