Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump form...
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| creator | MARK R BREEN THOMAS A BISHOP DIANA CARTER DUANE ERNEST R NOLAN CHUNG J LEE RICHARD D NELSON TODD H HERDER ROBERT W FROEHLICH RANDY L GERMAN KATHRYN V KESWICK KIMCUC T TRAN |
| description | Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump. |
| format | Patent |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same |
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