MIKRO-ELEKTRONISCHER AUFBAU

In accordance with the present invention, there are provided novel adhesive compositions which do not require solvent to provide a system having suitable viscosity for convenient handling and cure rapidly. The resulting thermosets are stable to elevated temperatures, are highly flexible, have low mo...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	PATTERSON, DENNIS B, OSUNA, JR, DERSHEM, STEPHEN M
Format:	Patent
Sprache:	ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON HETEROCYCLIC COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC CHEMISTRY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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