LEISTUNGSHALBLEITERMODUL IN DRUCKKONTAKTAUSFÜHRUNG SOWIE VERFAHREN ZUR HERSTELLUNG DESSELBEN

LEISTUNGSHALBLEITERMODUL IN DRUCKKONTAKTAUSFÜHRUNG SOWIE VERFAHREN ZUR HERSTELLUNG DESSELBEN

The module has two substrates (12), which include semiconductor components (20), where the substrates are arranged at a lower side of an assembly base plate (22). The assembly base plate has recesses (26), which are provided for holding contact bases (28), which are in pressure contact with conducti...

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Hauptverfasser: STEGER, JUERGEN, EBERSBERGER, FRANK
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creator STEGER, JUERGEN
EBERSBERGER, FRANK
description The module has two substrates (12), which include semiconductor components (20), where the substrates are arranged at a lower side of an assembly base plate (22). The assembly base plate has recesses (26), which are provided for holding contact bases (28), which are in pressure contact with conductive strips of the substrates. A cover (48) is connected with the assembly base plate using a snap catch connection. Two elastic cushion elements (42) are restrained between a cover and band sections (30) of load connection elements. An independent claim is also included for a method for manufacturing the semiconductor module.
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title LEISTUNGSHALBLEITERMODUL IN DRUCKKONTAKTAUSFÜHRUNG SOWIE VERFAHREN ZUR HERSTELLUNG DESSELBEN
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