EPOXIDHARZ-ZUSAMMENSETZUNG
An epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, and (C) an epoxidized polyisoprene (c-1) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 15000 to 200000 or an epoxidized polybutadiene (c-2) that contains an epox...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KITAYAMA, KOJI HIRATA, KEI MAEDA, MIZUHO |
| description | An epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, and (C) an epoxidized polyisoprene (c-1) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 15000 to 200000 or an epoxidized polybutadiene (c-2) that contains an epoxy group at 0 .15 to 2 meq/g in the molecule and has a number-average molecular weight of 20000 to 200000. The epoxy resin composition has high heat resistance and reduced internal stress, and can be suitably used in applications such as electronic part materials represented by semiconductor encapsulating materials and adhesives. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_ATE503800TT1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>ATE503800TT1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_ATE503800TT13</originalsourceid><addsrcrecordid>eNrjZJByDfCP8HTxcAyK0o0KDXb09XX1C3YNiQr1c-dhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGOIa6mBsYWBgYhIYbGxKgBAHXcIU4</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EPOXIDHARZ-ZUSAMMENSETZUNG</title><source>esp@cenet</source><creator>KITAYAMA, KOJI ; HIRATA, KEI ; MAEDA, MIZUHO</creator><creatorcontrib>KITAYAMA, KOJI ; HIRATA, KEI ; MAEDA, MIZUHO</creatorcontrib><description>An epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, and (C) an epoxidized polyisoprene (c-1) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 15000 to 200000 or an epoxidized polybutadiene (c-2) that contains an epoxy group at 0 .15 to 2 meq/g in the molecule and has a number-average molecular weight of 20000 to 200000. The epoxy resin composition has high heat resistance and reduced internal stress, and can be suitably used in applications such as electronic part materials represented by semiconductor encapsulating materials and adhesives.</description><language>ger</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110415&DB=EPODOC&CC=AT&NR=E503800T1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20110415&DB=EPODOC&CC=AT&NR=E503800T1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KITAYAMA, KOJI</creatorcontrib><creatorcontrib>HIRATA, KEI</creatorcontrib><creatorcontrib>MAEDA, MIZUHO</creatorcontrib><title>EPOXIDHARZ-ZUSAMMENSETZUNG</title><description>An epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, and (C) an epoxidized polyisoprene (c-1) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 15000 to 200000 or an epoxidized polybutadiene (c-2) that contains an epoxy group at 0 .15 to 2 meq/g in the molecule and has a number-average molecular weight of 20000 to 200000. The epoxy resin composition has high heat resistance and reduced internal stress, and can be suitably used in applications such as electronic part materials represented by semiconductor encapsulating materials and adhesives.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJByDfCP8HTxcAyK0o0KDXb09XX1C3YNiQr1c-dhYE1LzClO5YXS3AyKbq4hzh66qQX58anFBYnJqXmpJfGOIa6mBsYWBgYhIYbGxKgBAHXcIU4</recordid><startdate>20110415</startdate><enddate>20110415</enddate><creator>KITAYAMA, KOJI</creator><creator>HIRATA, KEI</creator><creator>MAEDA, MIZUHO</creator><scope>EVB</scope></search><sort><creationdate>20110415</creationdate><title>EPOXIDHARZ-ZUSAMMENSETZUNG</title><author>KITAYAMA, KOJI ; HIRATA, KEI ; MAEDA, MIZUHO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_ATE503800TT13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>ger</language><creationdate>2011</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KITAYAMA, KOJI</creatorcontrib><creatorcontrib>HIRATA, KEI</creatorcontrib><creatorcontrib>MAEDA, MIZUHO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KITAYAMA, KOJI</au><au>HIRATA, KEI</au><au>MAEDA, MIZUHO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EPOXIDHARZ-ZUSAMMENSETZUNG</title><date>2011-04-15</date><risdate>2011</risdate><abstract>An epoxy resin composition includes (A) an epoxy resin, (B) a curing agent, and (C) an epoxidized polyisoprene (c-1) that contains an epoxy group at 0.15 to 2 meq/g in the molecule and has a number-average molecular weight of 15000 to 200000 or an epoxidized polybutadiene (c-2) that contains an epoxy group at 0 .15 to 2 meq/g in the molecule and has a number-average molecular weight of 20000 to 200000. The epoxy resin composition has high heat resistance and reduced internal stress, and can be suitably used in applications such as electronic part materials represented by semiconductor encapsulating materials and adhesives.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | ger |
| recordid | cdi_epo_espacenet_ATE503800TT1 |
| source | esp@cenet |
| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | EPOXIDHARZ-ZUSAMMENSETZUNG |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T08%3A36%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KITAYAMA,%20KOJI&rft.date=2011-04-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EATE503800TT1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |