GESCHLITZTES SUBSTRAT UND DAZUGEHÖRIGES HERSTELLUNGSVERFAHREN
Techniques for fabricating an inkjet printhead include providing a printhead substrate (100), fabricating a thinfilm structure (101) on the substrate, forming a break trench (124) in a surface region of the substrate in which a feed slot is to be formed, and subsequently abrasively machining the sub...
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creator | HOSTETLER, TIMOTHY S |
description | Techniques for fabricating an inkjet printhead include providing a printhead substrate (100), fabricating a thinfilm structure (101) on the substrate, forming a break trench (124) in a surface region of the substrate in which a feed slot is to be formed, and subsequently abrasively machining the substrate through the break trench to form the feed slot (126). The break trench can be formed by an etch process, prior to applying a barrier layer (112) to the thinfilm structure in a preferred embodiment. |
format | Patent |
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The break trench can be formed by an etch process, prior to applying a barrier layer (112) to the thinfilm structure in a preferred embodiment.</description><language>ger</language><subject>CORRECTION OF TYPOGRAPHICAL ERRORS ; i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME ; LINING MACHINES ; PERFORMING OPERATIONS ; PRINTING ; SELECTIVE PRINTING MECHANISMS ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2008</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080815&DB=EPODOC&CC=AT&NR=E401198T1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20080815&DB=EPODOC&CC=AT&NR=E401198T1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HOSTETLER, TIMOTHY S</creatorcontrib><title>GESCHLITZTES SUBSTRAT UND DAZUGEHÖRIGES HERSTELLUNGSVERFAHREN</title><description>Techniques for fabricating an inkjet printhead include providing a printhead substrate (100), fabricating a thinfilm structure (101) on the substrate, forming a break trench (124) in a surface region of the substrate in which a feed slot is to be formed, and subsequently abrasively machining the substrate through the break trench to form the feed slot (126). The break trench can be formed by an etch process, prior to applying a barrier layer (112) to the thinfilm structure in a preferred embodiment.</description><subject>CORRECTION OF TYPOGRAPHICAL ERRORS</subject><subject>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</subject><subject>LINING MACHINES</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTING</subject><subject>SELECTIVE PRINTING MECHANISMS</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2008</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLBzdw129vDxDIkKcQ1WCA51Cg4JcgxRCPVzUXBxjAp1d_U4PC3IE6hIwcM1KDjE1ccn1M89OMw1yM3RI8jVj4eBNS0xpziVF0pzMyi6uYY4e-imFuTHpxYXJCan5qWWxDuGuJoYGBpaWoSEGBoTowYAI2MsSQ</recordid><startdate>20080815</startdate><enddate>20080815</enddate><creator>HOSTETLER, TIMOTHY S</creator><scope>EVB</scope></search><sort><creationdate>20080815</creationdate><title>GESCHLITZTES SUBSTRAT UND DAZUGEHÖRIGES HERSTELLUNGSVERFAHREN</title><author>HOSTETLER, TIMOTHY S</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_ATE401198TT13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>ger</language><creationdate>2008</creationdate><topic>CORRECTION OF TYPOGRAPHICAL ERRORS</topic><topic>i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME</topic><topic>LINING MACHINES</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTING</topic><topic>SELECTIVE PRINTING MECHANISMS</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>HOSTETLER, TIMOTHY S</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HOSTETLER, TIMOTHY S</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GESCHLITZTES SUBSTRAT UND DAZUGEHÖRIGES HERSTELLUNGSVERFAHREN</title><date>2008-08-15</date><risdate>2008</risdate><abstract>Techniques for fabricating an inkjet printhead include providing a printhead substrate (100), fabricating a thinfilm structure (101) on the substrate, forming a break trench (124) in a surface region of the substrate in which a feed slot is to be formed, and subsequently abrasively machining the substrate through the break trench to form the feed slot (126). The break trench can be formed by an etch process, prior to applying a barrier layer (112) to the thinfilm structure in a preferred embodiment.</abstract><oa>free_for_read</oa></addata></record> |
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language | ger |
recordid | cdi_epo_espacenet_ATE401198TT1 |
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subjects | CORRECTION OF TYPOGRAPHICAL ERRORS i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME LINING MACHINES PERFORMING OPERATIONS PRINTING SELECTIVE PRINTING MECHANISMS STAMPS TRANSPORTING TYPEWRITERS |
title | GESCHLITZTES SUBSTRAT UND DAZUGEHÖRIGES HERSTELLUNGSVERFAHREN |
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