POLIERKISSEN

The present invention relates to a polishing pad which is characterized in that it is of micro rubber A-type hardness at least 80 DEG , has closed cells of average cell diameter no more than 1000 mu m, is of density in the range 0.4 to 1.1 and contains polyurethane and polymer produced from a vinyl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	OKA, TETSUO, SHIRO, KUNIYASU, HASHISAKA, KAZUHIKO
Format:	Patent
Sprache:	ger
Schlagworte:	DRESSING OR CONDITIONING OF ABRADING SURFACES FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING TOOLS FOR GRINDING, BUFFING, OR SHARPENING TRANSPORTING
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