GEDRUCKTE SCHALTPLATTE MIT METALLISIERTEN LÖCHERN UND DEREN HERSTELLUNG
Through-hole plated single or multi-layer printed circuit boards (PCB's) are mfd. from a polymeric or ceramic substrate material, opt. provided on both sides with at least one electroconductive layer (by electroplating or electroless plating with metal), by a process providing plating on surfac...
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| creator | KRONENBERG, WALTER HUPE, JUERGEN |
| description | Through-hole plated single or multi-layer printed circuit boards (PCB's) are mfd. from a polymeric or ceramic substrate material, opt. provided on both sides with at least one electroconductive layer (by electroplating or electroless plating with metal), by a process providing plating on surfaces not coated with a conductive metal layer and including the through-holes. The process involves (a) pre-treating the substrate surfaces with an oxidising soln. (I); (b) removing residual (I) by rinsing, then treating with a soln. (II) contg. monomer selected from pyrrole, furnane, thiophene or derivs. and (c) transferring to an acid soln. (III) to cuase polymerisation of monomer into an surfaces conductive polymer layer (typically 0.1-10 microns thick). Residual (III)may be removed by rinsing, and galvanic or electroless metallisation carried out. Pref. prior to step (a), the substrate is subjected to a pretreatment of initial and surface prepn. of its non-conductive areas. |
| format | Patent |
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The process involves (a) pre-treating the substrate surfaces with an oxidising soln. (I); (b) removing residual (I) by rinsing, then treating with a soln. (II) contg. monomer selected from pyrrole, furnane, thiophene or derivs. and (c) transferring to an acid soln. (III) to cuase polymerisation of monomer into an surfaces conductive polymer layer (typically 0.1-10 microns thick). Residual (III)may be removed by rinsing, and galvanic or electroless metallisation carried out. Pref. prior to step (a), the substrate is subjected to a pretreatment of initial and surface prepn. of its non-conductive areas.</description><edition>5</edition><language>ger</language><subject>APPARATUS THEREFOR ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; CONDUCTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; INSULATORS ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PRINTED CIRCUITS ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>1994</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940915&DB=EPODOC&CC=AT&NR=E111294T1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25569,76552</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=19940915&DB=EPODOC&CC=AT&NR=E111294T1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KRONENBERG, WALTER</creatorcontrib><creatorcontrib>HUPE, JUERGEN</creatorcontrib><title>GEDRUCKTE SCHALTPLATTE MIT METALLISIERTEN LÖCHERN UND DEREN HERSTELLUNG</title><description>Through-hole plated single or multi-layer printed circuit boards (PCB's) are mfd. from a polymeric or ceramic substrate material, opt. provided on both sides with at least one electroconductive layer (by electroplating or electroless plating with metal), by a process providing plating on surfaces not coated with a conductive metal layer and including the through-holes. The process involves (a) pre-treating the substrate surfaces with an oxidising soln. (I); (b) removing residual (I) by rinsing, then treating with a soln. (II) contg. monomer selected from pyrrole, furnane, thiophene or derivs. and (c) transferring to an acid soln. (III) to cuase polymerisation of monomer into an surfaces conductive polymer layer (typically 0.1-10 microns thick). Residual (III)may be removed by rinsing, and galvanic or electroless metallisation carried out. Pref. prior to step (a), the substrate is subjected to a pretreatment of initial and surface prepn. of its non-conductive areas.</description><subject>APPARATUS THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>CONDUCTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROFORMING</subject><subject>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</subject><subject>INSULATORS</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PRINTED CIRCUITS</subject><subject>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>1994</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPBwd3UJCnX2DnFVCHb2cPQJCfBxDAFyfD1DFHxdQxx9fDyDPV2DQlz9FHwOT3P2cA3yUwj1c1FwcQ0CCgG5wSGuPj6hfu48DKxpiTnFqbxQmptB0c01xNlDN7UgPz61uCAxOTUvtSTeMcTV0NDQyNIkJMTQmBg1AJouLn8</recordid><startdate>19940915</startdate><enddate>19940915</enddate><creator>KRONENBERG, WALTER</creator><creator>HUPE, JUERGEN</creator><scope>EVB</scope></search><sort><creationdate>19940915</creationdate><title>GEDRUCKTE SCHALTPLATTE MIT METALLISIERTEN LÖCHERN UND DEREN HERSTELLUNG</title><author>KRONENBERG, WALTER ; HUPE, JUERGEN</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_ATE111294TT13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>ger</language><creationdate>1994</creationdate><topic>APPARATUS THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>CONDUCTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROFORMING</topic><topic>ELECTROLYTIC OR ELECTROPHORETIC PROCESSES</topic><topic>INSULATORS</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PRINTED CIRCUITS</topic><topic>PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>KRONENBERG, WALTER</creatorcontrib><creatorcontrib>HUPE, JUERGEN</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KRONENBERG, WALTER</au><au>HUPE, JUERGEN</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>GEDRUCKTE SCHALTPLATTE MIT METALLISIERTEN LÖCHERN UND DEREN HERSTELLUNG</title><date>1994-09-15</date><risdate>1994</risdate><abstract>Through-hole plated single or multi-layer printed circuit boards (PCB's) are mfd. from a polymeric or ceramic substrate material, opt. provided on both sides with at least one electroconductive layer (by electroplating or electroless plating with metal), by a process providing plating on surfaces not coated with a conductive metal layer and including the through-holes. The process involves (a) pre-treating the substrate surfaces with an oxidising soln. (I); (b) removing residual (I) by rinsing, then treating with a soln. (II) contg. monomer selected from pyrrole, furnane, thiophene or derivs. and (c) transferring to an acid soln. (III) to cuase polymerisation of monomer into an surfaces conductive polymer layer (typically 0.1-10 microns thick). Residual (III)may be removed by rinsing, and galvanic or electroless metallisation carried out. Pref. prior to step (a), the substrate is subjected to a pretreatment of initial and surface prepn. of its non-conductive areas.</abstract><edition>5</edition><oa>free_for_read</oa></addata></record> |
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| language | ger |
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| subjects | APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES INSULATORS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | GEDRUCKTE SCHALTPLATTE MIT METALLISIERTEN LÖCHERN UND DEREN HERSTELLUNG |
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