VERFAHREN ZUR HERSTELLUNG EINER LEITERPLATTE SOWIE VERWENDUNG UND LEITERPLATTE

The invention relates to a method for fixing a component (6) to or in a printed circuit board (1) and/or for connecting individual elements of a printed circuit board, wherein regions of a component (6) and/or of a printed circuit board (1) to be interconnected or to be fixed to one another are prov...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WEICHSLBERGER GUENTHER, STAHR JOHANNES
Format:	Patent
Sprache:	ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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