Water-cooled Copper-clad Invar Hybrid Power Circuit

Water cooling of hybrid modules allows a power dissipation much higher than that of conventional methods. This paper describes the design and construction of a copper-clad Invar water-cooled hybrid power circuit intended for use in a medical hand-held tool which is a 25 mm diameter cylinder. The the...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Microelectronics international 1988-01, Vol.5 (1), p.74-76
Hauptverfasser: Zardini, C, Pistre, J.D, Rodes, F, Aucouturier, J.L
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 76
container_issue 1
container_start_page 74
container_title Microelectronics international
container_volume 5
creator Zardini, C
Pistre, J.D
Rodes, F
Aucouturier, J.L
description Water cooling of hybrid modules allows a power dissipation much higher than that of conventional methods. This paper describes the design and construction of a copper-clad Invar water-cooled hybrid power circuit intended for use in a medical hand-held tool which is a 25 mm diameter cylinder. The thermal study demonstrates the interest of a copper-clad Invar heat exchanger: water flowing at a rate lower than 15 Ih−1 allows the dissipation of more than 50 W in the module while keeping the external temperature of the tool below 35°C.
doi_str_mv 10.1108/eb044312
format Article
fullrecord <record><control><sourceid>crossref_emera</sourceid><recordid>TN_cdi_emerald_primary_10_1108_eb044312</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>10_1108_eb044312</sourcerecordid><originalsourceid>FETCH-LOGICAL-c163t-1aabffc173f8e63e9b8a5c5809716a8d2a62007dfb046691a53ad9fc8c9ff25e3</originalsourceid><addsrcrecordid>eNp9z0FLxDAQBeAcFFxXwZ8Q8KCXaiZp0vQoRd2FBT0oHss0mUCla0pSlf337rLuTTw9HnwM8xi7AHEDIOwtdaIsFcgjNgOlTaGVkSfsNOd3IUCWUsyYesOJUuFiHMjzJo7jrg3o-fLjCxNfbLrUe_4cvynxpk_us5_O2HHAIdP5b87Z68P9S7MoVk-Py-ZuVTgwaioAsQvBQaWCJaOo7ixqp62oKzBovUQjhah82H5pTA2oFfo6OOvqEKQmNWfX-7suxZwThXZM_RrTpgXR7ga2h4FberWntKaEg_9PXv4tD6IdfVA_lw1c9g</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Water-cooled Copper-clad Invar Hybrid Power Circuit</title><source>Emerald Journals</source><creator>Zardini, C ; Pistre, J.D ; Rodes, F ; Aucouturier, J.L</creator><creatorcontrib>Zardini, C ; Pistre, J.D ; Rodes, F ; Aucouturier, J.L</creatorcontrib><description>Water cooling of hybrid modules allows a power dissipation much higher than that of conventional methods. This paper describes the design and construction of a copper-clad Invar water-cooled hybrid power circuit intended for use in a medical hand-held tool which is a 25 mm diameter cylinder. The thermal study demonstrates the interest of a copper-clad Invar heat exchanger: water flowing at a rate lower than 15 Ih−1 allows the dissipation of more than 50 W in the module while keeping the external temperature of the tool below 35°C.</description><identifier>ISSN: 1356-5362</identifier><identifier>DOI: 10.1108/eb044312</identifier><language>eng</language><publisher>MCB UP Ltd</publisher><ispartof>Microelectronics international, 1988-01, Vol.5 (1), p.74-76</ispartof><rights>MCB UP Limited</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/eb044312/full/pdf$$EPDF$$P50$$Gemerald$$H</linktopdf><linktohtml>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/eb044312/full/html$$EHTML$$P50$$Gemerald$$H</linktohtml><link.rule.ids>314,780,784,967,11634,27923,27924,52685,52688</link.rule.ids></links><search><creatorcontrib>Zardini, C</creatorcontrib><creatorcontrib>Pistre, J.D</creatorcontrib><creatorcontrib>Rodes, F</creatorcontrib><creatorcontrib>Aucouturier, J.L</creatorcontrib><title>Water-cooled Copper-clad Invar Hybrid Power Circuit</title><title>Microelectronics international</title><description>Water cooling of hybrid modules allows a power dissipation much higher than that of conventional methods. This paper describes the design and construction of a copper-clad Invar water-cooled hybrid power circuit intended for use in a medical hand-held tool which is a 25 mm diameter cylinder. The thermal study demonstrates the interest of a copper-clad Invar heat exchanger: water flowing at a rate lower than 15 Ih−1 allows the dissipation of more than 50 W in the module while keeping the external temperature of the tool below 35°C.</description><issn>1356-5362</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1988</creationdate><recordtype>article</recordtype><recordid>eNp9z0FLxDAQBeAcFFxXwZ8Q8KCXaiZp0vQoRd2FBT0oHss0mUCla0pSlf337rLuTTw9HnwM8xi7AHEDIOwtdaIsFcgjNgOlTaGVkSfsNOd3IUCWUsyYesOJUuFiHMjzJo7jrg3o-fLjCxNfbLrUe_4cvynxpk_us5_O2HHAIdP5b87Z68P9S7MoVk-Py-ZuVTgwaioAsQvBQaWCJaOo7ixqp62oKzBovUQjhah82H5pTA2oFfo6OOvqEKQmNWfX-7suxZwThXZM_RrTpgXR7ga2h4FberWntKaEg_9PXv4tD6IdfVA_lw1c9g</recordid><startdate>19880101</startdate><enddate>19880101</enddate><creator>Zardini, C</creator><creator>Pistre, J.D</creator><creator>Rodes, F</creator><creator>Aucouturier, J.L</creator><general>MCB UP Ltd</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>19880101</creationdate><title>Water-cooled Copper-clad Invar Hybrid Power Circuit</title><author>Zardini, C ; Pistre, J.D ; Rodes, F ; Aucouturier, J.L</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c163t-1aabffc173f8e63e9b8a5c5809716a8d2a62007dfb046691a53ad9fc8c9ff25e3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1988</creationdate><toplevel>online_resources</toplevel><creatorcontrib>Zardini, C</creatorcontrib><creatorcontrib>Pistre, J.D</creatorcontrib><creatorcontrib>Rodes, F</creatorcontrib><creatorcontrib>Aucouturier, J.L</creatorcontrib><collection>CrossRef</collection><jtitle>Microelectronics international</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Zardini, C</au><au>Pistre, J.D</au><au>Rodes, F</au><au>Aucouturier, J.L</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Water-cooled Copper-clad Invar Hybrid Power Circuit</atitle><jtitle>Microelectronics international</jtitle><date>1988-01-01</date><risdate>1988</risdate><volume>5</volume><issue>1</issue><spage>74</spage><epage>76</epage><pages>74-76</pages><issn>1356-5362</issn><abstract>Water cooling of hybrid modules allows a power dissipation much higher than that of conventional methods. This paper describes the design and construction of a copper-clad Invar water-cooled hybrid power circuit intended for use in a medical hand-held tool which is a 25 mm diameter cylinder. The thermal study demonstrates the interest of a copper-clad Invar heat exchanger: water flowing at a rate lower than 15 Ih−1 allows the dissipation of more than 50 W in the module while keeping the external temperature of the tool below 35°C.</abstract><pub>MCB UP Ltd</pub><doi>10.1108/eb044312</doi><tpages>3</tpages></addata></record>
fulltext fulltext
identifier ISSN: 1356-5362
ispartof Microelectronics international, 1988-01, Vol.5 (1), p.74-76
issn 1356-5362
language eng
recordid cdi_emerald_primary_10_1108_eb044312
source Emerald Journals
title Water-cooled Copper-clad Invar Hybrid Power Circuit
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T23%3A11%3A38IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-crossref_emera&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Water-cooled%20Copper-clad%20Invar%20Hybrid%20Power%20Circuit&rft.jtitle=Microelectronics%20international&rft.au=Zardini,%20C&rft.date=1988-01-01&rft.volume=5&rft.issue=1&rft.spage=74&rft.epage=76&rft.pages=74-76&rft.issn=1356-5362&rft_id=info:doi/10.1108/eb044312&rft_dat=%3Ccrossref_emera%3E10_1108_eb044312%3C/crossref_emera%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true