Study on the strength of diameter-reducing solder balls by shear and pull tests

Purpose The purpose of this paper is to study the variation of the mechanical strength and failure modes of solder balls with reducing diameters under conditions of multiple reflows. Design/methodology/approach The solder balls with diameters from 250 to 760 µm were mounted on the copper-clad lamina...

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Veröffentlicht in:	Soldering & surface mount technology 2019-09, Vol.31 (4), p.240-249
Hauptverfasser:	Yu, Kehang, Yang, Chen, Wang, Jun, Yu, Jiabo, Yang, Yi
Format:	Artikel
Sprache:	eng
Schlagworte:	Copper Displacement Experiments Failure analysis Failure modes Finite element method Fracture surfaces Grain size Interfaces Interfacial bonding Intermetallic compounds Morphology Shear strength Shear tests Strength Thermal cycling
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