Interfacial reaction of a Sn-3.0Ag-0.5Cu thin film during solder reflow

Purpose - The purpose of this paper is to produce and investigate the interfacial reaction between Sn-3.0Ag-0.5Cu (SAC305) thin films and Cu substrates by solder reflow at various temperatures and times.Design methodology approach - SAC305 thin films were deposited on copper substrates using a therm...

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Veröffentlicht in:	Soldering & surface mount technology 2013-01, Vol.25 (1), p.15-23
Hauptverfasser:	Mei Lee, Liu, Haliman, Habsah, Azmin Mohamad, Ahmad
Format:	Artikel
Sprache:	eng
Schlagworte:	Alloys Copper Cross sections Deposition Evaporation Interface reactions Intermetallic compounds Oxidation R&D Research & development Soldering Solders Studies Temperature effects Thin films Tin Tin base alloys Wire
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