Effect of particle size distribution (PSD) and flux medium on the creep recovery performance of lead-free solder pastes

Purpose - The purpose of this paper is to investigate how the formulation of a solder paste (with regards to the flux and particle size distribution (PSD)), can influence its creep and recovery performance.Design methodology approach - New lead-free paste formulations were characterised utilising vi...

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Veröffentlicht in:	Soldering & surface mount technology 2011-01, Vol.23 (2), p.75-84
Hauptverfasser:	Marks, A.E, Ekere, N.N, Mallik, S, Bhatti, R
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Creep (materials) Design. Technologies. Operation analysis. Testing Electronics Exact sciences and technology Flux Formulations Integrated circuits Investigations Lead Materials creep Particle size Pastes Printing Prints Quality control Recovery Rheology Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Soldering Solders Studies Viscosity
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