The impact of underfill properties on the thermomechanical reliability of FCOB assembly
The impact of underfill properties on the thermomechanical reliability of flip chip on board (FCOB) assembly is addressed in this paper. FCOB assemblies using three underfill encapsulants were subjected to a thermal cycling test. The performance of the underfill encapsulants was assessed by a statis...
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| Veröffentlicht in: | Soldering & surface mount technology 2000-08, Vol.12 (2), p.37-41 |
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| container_title | Soldering & surface mount technology |
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| creator | Lu, Jicun Wu, Jianhua Pin Liew, Yih Beng Lim, Thiam Zong, Xiangfu |
| description | The impact of underfill properties on the thermomechanical reliability of flip chip on board (FCOB) assembly is addressed in this paper. FCOB assemblies using three underfill encapsulants were subjected to a thermal cycling test. The performance of the underfill encapsulants was assessed by a statistical analysis of the failure distribution of the FCOB assemblies. The failure modes in the thermal cycling test were found to be solder joint cracks, delamination at underfill chip passivation interface, and underfill internal cracks. An attempt was made to correlate these failures with underfill properties such as the coefficient of thermal expansion (CTE), modulus, glass transition temperature (Tg), and adhesive strength to the chip. Additionally, nonlinear finite element analysis (FEA) was conducted to verify the experimental results. |
| doi_str_mv | 10.1108/09540910010331455 |
| format | Article |
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FCOB assemblies using three underfill encapsulants were subjected to a thermal cycling test. The performance of the underfill encapsulants was assessed by a statistical analysis of the failure distribution of the FCOB assemblies. The failure modes in the thermal cycling test were found to be solder joint cracks, delamination at underfill chip passivation interface, and underfill internal cracks. An attempt was made to correlate these failures with underfill properties such as the coefficient of thermal expansion (CTE), modulus, glass transition temperature (Tg), and adhesive strength to the chip. Additionally, nonlinear finite element analysis (FEA) was conducted to verify the experimental results.</description><identifier>ISSN: 0954-0911</identifier><identifier>EISSN: 1758-6836</identifier><identifier>DOI: 10.1108/09540910010331455</identifier><identifier>CODEN: SSMOEO</identifier><language>eng</language><publisher>Bradford: MCB UP Ltd</publisher><subject>Adhesives ; Crack propagation ; Cracks ; Delamination ; Experiments ; Failure analysis ; Finite element analysis ; Finite element method ; Flip chip on board ; Microscopy ; Reliability ; Shear tests ; Silicon ; Soldering ; Thermal cycling ; Thermodynamics ; Underfill</subject><ispartof>Soldering & surface mount technology, 2000-08, Vol.12 (2), p.37-41</ispartof><rights>MCB UP Limited</rights><rights>Copyright MCB UP Limited (MCB) 2000</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c511t-e47a7f06d2fafb3cfdbc953c36a9f72214e16ea3669338f2ca1f4b18a2c630883</citedby><cites>FETCH-LOGICAL-c511t-e47a7f06d2fafb3cfdbc953c36a9f72214e16ea3669338f2ca1f4b18a2c630883</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/09540910010331455/full/pdf$$EPDF$$P50$$Gemerald$$H</linktopdf><linktohtml>$$Uhttps://www.emerald.com/insight/content/doi/10.1108/09540910010331455/full/html$$EHTML$$P50$$Gemerald$$H</linktohtml><link.rule.ids>314,776,780,961,11615,27903,27904,52664,52667</link.rule.ids></links><search><creatorcontrib>Lu, Jicun</creatorcontrib><creatorcontrib>Wu, Jianhua</creatorcontrib><creatorcontrib>Pin Liew, Yih</creatorcontrib><creatorcontrib>Beng Lim, Thiam</creatorcontrib><creatorcontrib>Zong, Xiangfu</creatorcontrib><title>The impact of underfill properties on the thermomechanical reliability of FCOB assembly</title><title>Soldering & surface mount technology</title><description>The impact of underfill properties on the thermomechanical reliability of flip chip on board (FCOB) assembly is addressed in this paper. FCOB assemblies using three underfill encapsulants were subjected to a thermal cycling test. The performance of the underfill encapsulants was assessed by a statistical analysis of the failure distribution of the FCOB assemblies. The failure modes in the thermal cycling test were found to be solder joint cracks, delamination at underfill chip passivation interface, and underfill internal cracks. An attempt was made to correlate these failures with underfill properties such as the coefficient of thermal expansion (CTE), modulus, glass transition temperature (Tg), and adhesive strength to the chip. Additionally, nonlinear finite element analysis (FEA) was conducted to verify the experimental results.</description><subject>Adhesives</subject><subject>Crack propagation</subject><subject>Cracks</subject><subject>Delamination</subject><subject>Experiments</subject><subject>Failure analysis</subject><subject>Finite element analysis</subject><subject>Finite element method</subject><subject>Flip chip on board</subject><subject>Microscopy</subject><subject>Reliability</subject><subject>Shear tests</subject><subject>Silicon</subject><subject>Soldering</subject><subject>Thermal cycling</subject><subject>Thermodynamics</subject><subject>Underfill</subject><issn>0954-0911</issn><issn>1758-6836</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2000</creationdate><recordtype>article</recordtype><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><sourceid>GNUQQ</sourceid><recordid>eNqN0T1vFDEQBmALgcQR-AHpVhTQsGH8bZdwIgHppKS4kNLyem3FwfuBvSdx_x6fLqIgKKSwXPh5PaMZhE4xnGEM6iNozkBjAAyUYsb5M7TCkqtWKCqeo9Xhva0Av0SvSrkDACY0XaGb7a1v4jBbtzRTaHZj73OIKTVznmafl-hLM43NUlU9eZgG727tGJ1NTfYp2i6muOwP2fP15efGluKHLu1foxfBpuLf3N8n6Pr8y3b9td1cXnxbf9q0jmO8tJ5JKwOIngQbOupC3znNqaPC6iAJwcxj4S0VtVmqAnEWB9ZhZYkTFJSiJ-j98d_a78-dL4sZYnE-JTv6aVeMZFQKIYiu8t2jshLGNDwBKsG0BvV_KCWRWvEK3_4F76ZdHutcDMGCAJHiUBYfkctTKdkHM-c42Lw3GMxhx-bBjmumPWZiWfyvPwGbfxghqeSG3RDzHW-uYM235qJ6OHo_-GxT_6QSH_4deUDN3Af6G-EVwms</recordid><startdate>20000801</startdate><enddate>20000801</enddate><creator>Lu, Jicun</creator><creator>Wu, Jianhua</creator><creator>Pin Liew, Yih</creator><creator>Beng Lim, Thiam</creator><creator>Zong, Xiangfu</creator><general>MCB UP Ltd</general><general>Emerald Group Publishing Limited</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7RQ</scope><scope>7SP</scope><scope>7TB</scope><scope>7WY</scope><scope>7XB</scope><scope>8BQ</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BEZIV</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>FR3</scope><scope>GNUQQ</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>K6~</scope><scope>KB.</scope><scope>KR7</scope><scope>L.-</scope><scope>L7M</scope><scope>M0F</scope><scope>M2P</scope><scope>PDBOC</scope><scope>PQBIZ</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>Q9U</scope></search><sort><creationdate>20000801</creationdate><title>The impact of underfill properties on the thermomechanical reliability of FCOB assembly</title><author>Lu, Jicun ; Wu, Jianhua ; Pin Liew, Yih ; Beng Lim, Thiam ; Zong, Xiangfu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c511t-e47a7f06d2fafb3cfdbc953c36a9f72214e16ea3669338f2ca1f4b18a2c630883</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2000</creationdate><topic>Adhesives</topic><topic>Crack propagation</topic><topic>Cracks</topic><topic>Delamination</topic><topic>Experiments</topic><topic>Failure analysis</topic><topic>Finite element analysis</topic><topic>Finite element method</topic><topic>Flip chip on board</topic><topic>Microscopy</topic><topic>Reliability</topic><topic>Shear tests</topic><topic>Silicon</topic><topic>Soldering</topic><topic>Thermal cycling</topic><topic>Thermodynamics</topic><topic>Underfill</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Lu, Jicun</creatorcontrib><creatorcontrib>Wu, Jianhua</creatorcontrib><creatorcontrib>Pin Liew, Yih</creatorcontrib><creatorcontrib>Beng Lim, Thiam</creatorcontrib><creatorcontrib>Zong, Xiangfu</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><collection>Career & Technical Education Database</collection><collection>Electronics & Communications Abstracts</collection><collection>Mechanical & Transportation Engineering Abstracts</collection><collection>ABI/INFORM Collection</collection><collection>ProQuest Central (purchase pre-March 2016)</collection><collection>METADEX</collection><collection>Technology Research Database</collection><collection>ProQuest SciTech Collection</collection><collection>ProQuest Technology Collection</collection><collection>Materials Science & Engineering Collection</collection><collection>ProQuest Central UK/Ireland</collection><collection>ProQuest Central Essentials</collection><collection>ProQuest Central</collection><collection>Business Premium Collection</collection><collection>Technology Collection</collection><collection>ProQuest One Community College</collection><collection>ProQuest Materials Science Collection</collection><collection>ProQuest Central Korea</collection><collection>Engineering Research Database</collection><collection>ProQuest Central Student</collection><collection>SciTech Premium Collection</collection><collection>Materials Research Database</collection><collection>ProQuest Business Collection</collection><collection>Materials Science Database</collection><collection>Civil Engineering Abstracts</collection><collection>ABI/INFORM Professional Advanced</collection><collection>Advanced Technologies Database with Aerospace</collection><collection>ABI/INFORM Trade & Industry</collection><collection>Science Database</collection><collection>Materials Science Collection</collection><collection>ProQuest One Business</collection><collection>ProQuest One Academic Eastern Edition (DO NOT USE)</collection><collection>ProQuest One Academic</collection><collection>ProQuest One Academic UKI Edition</collection><collection>ProQuest Central Basic</collection><jtitle>Soldering & surface mount technology</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Lu, Jicun</au><au>Wu, Jianhua</au><au>Pin Liew, Yih</au><au>Beng Lim, Thiam</au><au>Zong, Xiangfu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>The impact of underfill properties on the thermomechanical reliability of FCOB assembly</atitle><jtitle>Soldering & surface mount technology</jtitle><date>2000-08-01</date><risdate>2000</risdate><volume>12</volume><issue>2</issue><spage>37</spage><epage>41</epage><pages>37-41</pages><issn>0954-0911</issn><eissn>1758-6836</eissn><coden>SSMOEO</coden><abstract>The impact of underfill properties on the thermomechanical reliability of flip chip on board (FCOB) assembly is addressed in this paper. FCOB assemblies using three underfill encapsulants were subjected to a thermal cycling test. The performance of the underfill encapsulants was assessed by a statistical analysis of the failure distribution of the FCOB assemblies. The failure modes in the thermal cycling test were found to be solder joint cracks, delamination at underfill chip passivation interface, and underfill internal cracks. An attempt was made to correlate these failures with underfill properties such as the coefficient of thermal expansion (CTE), modulus, glass transition temperature (Tg), and adhesive strength to the chip. Additionally, nonlinear finite element analysis (FEA) was conducted to verify the experimental results.</abstract><cop>Bradford</cop><pub>MCB UP Ltd</pub><doi>10.1108/09540910010331455</doi><tpages>5</tpages></addata></record> |
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| source | Emerald Journals |
| subjects | Adhesives Crack propagation Cracks Delamination Experiments Failure analysis Finite element analysis Finite element method Flip chip on board Microscopy Reliability Shear tests Silicon Soldering Thermal cycling Thermodynamics Underfill |
| title | The impact of underfill properties on the thermomechanical reliability of FCOB assembly |
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