Competing failure mechanisms of thin metal films on polymer substrates under tension
The ductility of thin metal films on polymer substrates reported in recent experiments has a huge disparity, ranging from less than 1 % up to more than 50 %. To reveal the underpinning origins for such a large variation, this paper reports a systematic computational study of two competing failure me...
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| Veröffentlicht in: | Theoretical and applied mechanics letters 2011-01, Vol.1 (4), p.15-18, Article 041002 |
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| container_title | Theoretical and applied mechanics letters |
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| creator | Li, Teng Zhang, Zhao Michaux, Benoit |
| description | The ductility of thin metal films on polymer substrates reported in recent experiments has a huge disparity, ranging from less than 1 % up to more than 50 %. To reveal the underpinning origins for such a large variation, this paper reports a systematic computational study of two competing failure mechanisms: metal film necking and grain boundary cracking. The quantitative results suggest that strong grain boundaries and metal/polymer interfacial adhesion are keys to achieve high ductility of polymer-supported metal films. |
| doi_str_mv | 10.1063/2.1104102 |
| format | Article |
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| ispartof | Theoretical and applied mechanics letters, 2011-01, Vol.1 (4), p.15-18, Article 041002 |
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| language | eng |
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| subjects | ductility grain boundaries nanocrystalline materials polymers thin metal films |
| title | Competing failure mechanisms of thin metal films on polymer substrates under tension |
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