Flip Chip Bonding of 68 x 68 MWIR LED Arrays

The flip chip bonding process is optimized by varying the bonding pressure, temperature, and time. The 68 68 mid wave infrared (MWIR) LED array was hybridized onto Si-CMOS driver array with same number of pixels. Each pixel has two indium bumps, one for cathode and another for anode. Both LED array...

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Bibliographische Detailangaben
Hauptverfasser:	Das, Naresh C, Taysing-Lara, Monica, Olver, Kimberley A, Kiamilev, Fouad, Prineas, J P, Olesberg, J T, Koerperick, E J, Murray, L M, Boggess, Tom F
Format:	Report
Sprache:	eng
Schlagworte:	ARRAYS BONDING COMPLEMENTARY METAL OXIDE SEMICONDUCTORS CONTACT RESISTANCE CRYOGENIC TESTING Electrical and Electronic Equipment ELECTRICAL PROPERTIES FLIP CHIPS INDIUM INTERMEDIATE INFRARED RADIATION LIGHT EMITTING DIODES OPTICAL PROPERTIES OPTIMIZATION PRESSURE REPRINTS SILICON Solid State Physics TEMPERATURE TIME
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