Annealing of Boron-Implanted Silicon by a Heat-Assisted Noncoherent Light Flash

High quality annealing of boron implanted silicon 10 to the 15th power/sq cm, 50 keV) was achieved using commercially available quartz xenon flash tubes after a 20 second preheat. Electrically active dopant profiles, obtained from spreading resistance profiles, indicate that the annealing proceeded...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Bomke,H A, Berkowitz,H L, Harmatz,M, Kronenberg,S, Lux,R
Format: Report
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator Bomke,H A
Berkowitz,H L
Harmatz,M
Kronenberg,S
Lux,R
description High quality annealing of boron implanted silicon 10 to the 15th power/sq cm, 50 keV) was achieved using commercially available quartz xenon flash tubes after a 20 second preheat. Electrically active dopant profiles, obtained from spreading resistance profiles, indicate that the annealing proceeded by solid phase epitaxy. We also find that the degree of boron redistribution can be controlled by the cumulative exposure to the flash. Characteristics of the apparatus used suggest that annealing 3 inch diameter wafers with a throughput of 3 wafers per minute is feasible. (Author)
format Report
fullrecord <record><control><sourceid>dtic_1RU</sourceid><recordid>TN_cdi_dtic_stinet_ADA100645</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>ADA100645</sourcerecordid><originalsourceid>FETCH-dtic_stinet_ADA1006453</originalsourceid><addsrcrecordid>eNqFyb0KwkAMAOAuDqK-gUNe4KDiz35VSwXRQfdyXtNe4EykyeLbi-Du9A3ftLh6ZgyZeADpoZJR2J2erxzYsIMbZYrC8HhDgAaDOa9K-q2LcJSEI7LBmYZkUOegaV5M-pAVFz9nxbI-3veN64xiq0aM1vqDX5XlbrNd_-kPvOgzBA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>report</recordtype></control><display><type>report</type><title>Annealing of Boron-Implanted Silicon by a Heat-Assisted Noncoherent Light Flash</title><source>DTIC Technical Reports</source><creator>Bomke,H A ; Berkowitz,H L ; Harmatz,M ; Kronenberg,S ; Lux,R</creator><creatorcontrib>Bomke,H A ; Berkowitz,H L ; Harmatz,M ; Kronenberg,S ; Lux,R ; ARMY ELECTRONICS RESEARCH AND DEVELOPMENT COMMAND FORT MONMOUTH NJ ELECTRONICS TECHNOLOGY/DEVICES LAB</creatorcontrib><description>High quality annealing of boron implanted silicon 10 to the 15th power/sq cm, 50 keV) was achieved using commercially available quartz xenon flash tubes after a 20 second preheat. Electrically active dopant profiles, obtained from spreading resistance profiles, indicate that the annealing proceeded by solid phase epitaxy. We also find that the degree of boron redistribution can be controlled by the cumulative exposure to the flash. Characteristics of the apparatus used suggest that annealing 3 inch diameter wafers with a throughput of 3 wafers per minute is feasible. (Author)</description><language>eng</language><subject>ANNEALING ; AS91A ; BORON ; DISTRIBUTION ; ELECTROMAGNETIC RADIATION ; EPITAXIAL GROWTH ; FLASHES ; IMPLANTATION ; IRRADIATION ; Light flashes ; Mfg &amp; Industrial Eng &amp; Control of Product Sys ; PE61101A ; Quartz xenon flash tubes ; SEMICONDUCTORS ; SILICON ; Solid State Physics ; WU475</subject><creationdate>1981</creationdate><rights>APPROVED FOR PUBLIC RELEASE</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>230,776,881,27544,27545</link.rule.ids><linktorsrc>$$Uhttps://apps.dtic.mil/sti/citations/ADA100645$$EView_record_in_DTIC$$FView_record_in_$$GDTIC$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>Bomke,H A</creatorcontrib><creatorcontrib>Berkowitz,H L</creatorcontrib><creatorcontrib>Harmatz,M</creatorcontrib><creatorcontrib>Kronenberg,S</creatorcontrib><creatorcontrib>Lux,R</creatorcontrib><creatorcontrib>ARMY ELECTRONICS RESEARCH AND DEVELOPMENT COMMAND FORT MONMOUTH NJ ELECTRONICS TECHNOLOGY/DEVICES LAB</creatorcontrib><title>Annealing of Boron-Implanted Silicon by a Heat-Assisted Noncoherent Light Flash</title><description>High quality annealing of boron implanted silicon 10 to the 15th power/sq cm, 50 keV) was achieved using commercially available quartz xenon flash tubes after a 20 second preheat. Electrically active dopant profiles, obtained from spreading resistance profiles, indicate that the annealing proceeded by solid phase epitaxy. We also find that the degree of boron redistribution can be controlled by the cumulative exposure to the flash. Characteristics of the apparatus used suggest that annealing 3 inch diameter wafers with a throughput of 3 wafers per minute is feasible. (Author)</description><subject>ANNEALING</subject><subject>AS91A</subject><subject>BORON</subject><subject>DISTRIBUTION</subject><subject>ELECTROMAGNETIC RADIATION</subject><subject>EPITAXIAL GROWTH</subject><subject>FLASHES</subject><subject>IMPLANTATION</subject><subject>IRRADIATION</subject><subject>Light flashes</subject><subject>Mfg &amp; Industrial Eng &amp; Control of Product Sys</subject><subject>PE61101A</subject><subject>Quartz xenon flash tubes</subject><subject>SEMICONDUCTORS</subject><subject>SILICON</subject><subject>Solid State Physics</subject><subject>WU475</subject><fulltext>true</fulltext><rsrctype>report</rsrctype><creationdate>1981</creationdate><recordtype>report</recordtype><sourceid>1RU</sourceid><recordid>eNqFyb0KwkAMAOAuDqK-gUNe4KDiz35VSwXRQfdyXtNe4EykyeLbi-Du9A3ftLh6ZgyZeADpoZJR2J2erxzYsIMbZYrC8HhDgAaDOa9K-q2LcJSEI7LBmYZkUOegaV5M-pAVFz9nxbI-3veN64xiq0aM1vqDX5XlbrNd_-kPvOgzBA</recordid><startdate>198105</startdate><enddate>198105</enddate><creator>Bomke,H A</creator><creator>Berkowitz,H L</creator><creator>Harmatz,M</creator><creator>Kronenberg,S</creator><creator>Lux,R</creator><scope>1RU</scope><scope>BHM</scope></search><sort><creationdate>198105</creationdate><title>Annealing of Boron-Implanted Silicon by a Heat-Assisted Noncoherent Light Flash</title><author>Bomke,H A ; Berkowitz,H L ; Harmatz,M ; Kronenberg,S ; Lux,R</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-dtic_stinet_ADA1006453</frbrgroupid><rsrctype>reports</rsrctype><prefilter>reports</prefilter><language>eng</language><creationdate>1981</creationdate><topic>ANNEALING</topic><topic>AS91A</topic><topic>BORON</topic><topic>DISTRIBUTION</topic><topic>ELECTROMAGNETIC RADIATION</topic><topic>EPITAXIAL GROWTH</topic><topic>FLASHES</topic><topic>IMPLANTATION</topic><topic>IRRADIATION</topic><topic>Light flashes</topic><topic>Mfg &amp; Industrial Eng &amp; Control of Product Sys</topic><topic>PE61101A</topic><topic>Quartz xenon flash tubes</topic><topic>SEMICONDUCTORS</topic><topic>SILICON</topic><topic>Solid State Physics</topic><topic>WU475</topic><toplevel>online_resources</toplevel><creatorcontrib>Bomke,H A</creatorcontrib><creatorcontrib>Berkowitz,H L</creatorcontrib><creatorcontrib>Harmatz,M</creatorcontrib><creatorcontrib>Kronenberg,S</creatorcontrib><creatorcontrib>Lux,R</creatorcontrib><creatorcontrib>ARMY ELECTRONICS RESEARCH AND DEVELOPMENT COMMAND FORT MONMOUTH NJ ELECTRONICS TECHNOLOGY/DEVICES LAB</creatorcontrib><collection>DTIC Technical Reports</collection><collection>DTIC STINET</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Bomke,H A</au><au>Berkowitz,H L</au><au>Harmatz,M</au><au>Kronenberg,S</au><au>Lux,R</au><aucorp>ARMY ELECTRONICS RESEARCH AND DEVELOPMENT COMMAND FORT MONMOUTH NJ ELECTRONICS TECHNOLOGY/DEVICES LAB</aucorp><format>book</format><genre>unknown</genre><ristype>RPRT</ristype><btitle>Annealing of Boron-Implanted Silicon by a Heat-Assisted Noncoherent Light Flash</btitle><date>1981-05</date><risdate>1981</risdate><abstract>High quality annealing of boron implanted silicon 10 to the 15th power/sq cm, 50 keV) was achieved using commercially available quartz xenon flash tubes after a 20 second preheat. Electrically active dopant profiles, obtained from spreading resistance profiles, indicate that the annealing proceeded by solid phase epitaxy. We also find that the degree of boron redistribution can be controlled by the cumulative exposure to the flash. Characteristics of the apparatus used suggest that annealing 3 inch diameter wafers with a throughput of 3 wafers per minute is feasible. (Author)</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_dtic_stinet_ADA100645
source DTIC Technical Reports
subjects ANNEALING
AS91A
BORON
DISTRIBUTION
ELECTROMAGNETIC RADIATION
EPITAXIAL GROWTH
FLASHES
IMPLANTATION
IRRADIATION
Light flashes
Mfg & Industrial Eng & Control of Product Sys
PE61101A
Quartz xenon flash tubes
SEMICONDUCTORS
SILICON
Solid State Physics
WU475
title Annealing of Boron-Implanted Silicon by a Heat-Assisted Noncoherent Light Flash
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-08T01%3A56%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-dtic_1RU&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=unknown&rft.btitle=Annealing%20of%20Boron-Implanted%20Silicon%20by%20a%20Heat-Assisted%20Noncoherent%20Light%20Flash&rft.au=Bomke,H%20A&rft.aucorp=ARMY%20ELECTRONICS%20RESEARCH%20AND%20DEVELOPMENT%20COMMAND%20FORT%20MONMOUTH%20NJ%20ELECTRONICS%20TECHNOLOGY/DEVICES%20LAB&rft.date=1981-05&rft_id=info:doi/&rft_dat=%3Cdtic_1RU%3EADA100645%3C/dtic_1RU%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true