Enhanced Thermal Conductivity and Dielectric Properties of Iron Oxide/Polyethylene Nanocomposites Induced by a Magnetic Field

Iron Oxide (Fe 3 O 4 ) nanoparticles were deposited on the surface of low density polyethylene (LDPE) particles by solvothermal method. A magnetic field was introduced to the preparation of Fe 3 O 4 /LDPE composites, and the influences of the magnetic field on thermal conductivity and dielectric pro...

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Veröffentlicht in:Scientific reports 2017-06, Vol.7 (1), p.3072-11, Article 3072
Hauptverfasser: Chi, Qingguo, Ma, Tao, Dong, Jiufeng, Cui, Yang, Zhang, Yue, Zhang, Changhai, Xu, Shichong, Wang, Xuan, Lei, Qingquan
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Sprache:eng
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Zusammenfassung:Iron Oxide (Fe 3 O 4 ) nanoparticles were deposited on the surface of low density polyethylene (LDPE) particles by solvothermal method. A magnetic field was introduced to the preparation of Fe 3 O 4 /LDPE composites, and the influences of the magnetic field on thermal conductivity and dielectric properties of composites were investigated systematically. The Fe 3 O 4 /LDPE composites treated by a vertical direction magnetic field exhibited a high thermal conductivity and a large dielectric constant at low filler loading. The enhancement of thermal conductivity and dielectric constant is attributed to the formation of the conductive chains of Fe 3 O 4 in LDPE matrix under the action of the magnetic field, which can effectively enhance the heat flux and interfacial polarization of the Fe 3 O 4 /LDPE composites. Moreover, the relatively low dielectric loss and low conductivity achieved are attributed to the low volume fraction of fillers and excellent compatibility between Fe 3 O 4 and LDPE. Of particular note is the dielectric properties of Fe 3 O 4 /LDPE composites induced by the magnetic field also retain good stability across a wide temperature range, and this contributes to the stability and lifespan of polymer capacitors. All the above-mentioned properties along with the simplicity and scalability of the preparation for the polymer nanocomposites make them promising for the electronics industry.
ISSN:2045-2322
2045-2322
DOI:10.1038/s41598-017-03273-z