X-ray evaluation of high-verticality sidewalls fabricated by deep reactive ion etching

We report the fabrication and characterization of high-verticality sidewalls by deep reactive ion etching (DRIE). We quantitatively evaluated the verticality of the sidewalls with a width of 20 µm and a depth of 300 µm by using an X-ray beam (1.49 keV). To the best of our knowledge, we succeeded in...

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Veröffentlicht in:Japanese Journal of Applied Physics 2017-06, Vol.56 (6S1), p.6
Hauptverfasser: Takeuchi, Kazuma, Ezoe, Yuichiro, Ishikawa, Kumi, Nakamura, Kasumi, Numazawa, Masaki, Terada, Masaru, Fujitani, Maiko, Ishi, Daiki, Noda, Yusuke, Ohashi, Takaya, Morishita, Kohei, Nakajima, Kazuo, Mitsuda, Kazuhisa
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Sprache:eng
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