Analyzing and modeling methods for warpages of thin and large dies with redistribution layer
Analyzing and modeling methods for warpages including cylindrical deformations are discussed in large-area dies with redistribution layers (RDLs) and thin 50-µm-thick Si substrates. The buckling behavior of warpage, a deformation transition from spherical to cylindrical, strongly depends on the late...
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| Veröffentlicht in: | Japanese Journal of Applied Physics 2016-06, Vol.55 (6S3), p.6-06JC03 |
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| container_end_page | 06JC03 |
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| container_issue | 6S3 |
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| container_title | Japanese Journal of Applied Physics |
| container_volume | 55 |
| creator | Dote, Aki Kitada, Hideki Mizushima, Yoriko Nakamura, Tomoji Sakuyama, Seiki |
| description | Analyzing and modeling methods for warpages including cylindrical deformations are discussed in large-area dies with redistribution layers (RDLs) and thin 50-µm-thick Si substrates. The buckling behavior of warpage, a deformation transition from spherical to cylindrical, strongly depends on the lateral sizes of the dies and the RDL structures, and can be calculated using the analytical model of the nonlinear plate theory. The equivalent stress values are introduced to simplify RDL structures by applying the model to measured curvatures of homogeneous patterned samples. Area densities of Cu are a good index for evaluating die warpage even for inhomogeneous patterned RDLs. |
| doi_str_mv | 10.7567/JJAP.55.06JC03 |
| format | Article |
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The buckling behavior of warpage, a deformation transition from spherical to cylindrical, strongly depends on the lateral sizes of the dies and the RDL structures, and can be calculated using the analytical model of the nonlinear plate theory. The equivalent stress values are introduced to simplify RDL structures by applying the model to measured curvatures of homogeneous patterned samples. 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J. Appl. Phys</addtitle><description>Analyzing and modeling methods for warpages including cylindrical deformations are discussed in large-area dies with redistribution layers (RDLs) and thin 50-µm-thick Si substrates. The buckling behavior of warpage, a deformation transition from spherical to cylindrical, strongly depends on the lateral sizes of the dies and the RDL structures, and can be calculated using the analytical model of the nonlinear plate theory. The equivalent stress values are introduced to simplify RDL structures by applying the model to measured curvatures of homogeneous patterned samples. Area densities of Cu are a good index for evaluating die warpage even for inhomogeneous patterned RDLs.</description><subject>Deformation</subject><subject>Dies</subject><subject>Equivalence</subject><subject>Mathematical analysis</subject><subject>Mathematical models</subject><subject>Modelling</subject><subject>Plate theory</subject><subject>Warpage</subject><issn>0021-4922</issn><issn>1347-4065</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2016</creationdate><recordtype>article</recordtype><recordid>eNqVkE1LxDAURYMoOI5uXXcpQms-m3Y5DH4NgoKzFELaJDMpbVOTlmH89bZ2_oCrx33v3Lc4ANwimHCW8ofNZvWRMJbAdLOG5AwsEKE8pjBl52ABIUYxzTG-BFchVGNMGUUL8LVqZX38se0ukq2KGqd0PYVG93unQmScjw7Sd3KnQ-RM1O9t-0fW0u90pOy4Pth-H3mtbOi9LYbeunY8H7W_BhdG1kHfnOYSbJ8et-uX-O39-XW9eotLQlEfpxlWNEt5bigmiufaaANRZoiUpMhKCHOeZRIjZLAsOMQQ57TIuR4pkjJIluBuftt59z3o0IvGhlLXtWy1G4JAOaQYsoxPaDKjpXcheG1E520j_VEgKCaLYrIoGBOzxbFwPxes60TlBj_qCv-Dq0p2E5R-khMoOmXILw-agPE</recordid><startdate>20160601</startdate><enddate>20160601</enddate><creator>Dote, Aki</creator><creator>Kitada, Hideki</creator><creator>Mizushima, Yoriko</creator><creator>Nakamura, Tomoji</creator><creator>Sakuyama, Seiki</creator><general>The Japan Society of Applied Physics</general><scope>AAYXX</scope><scope>CITATION</scope><scope>7U5</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>20160601</creationdate><title>Analyzing and modeling methods for warpages of thin and large dies with redistribution layer</title><author>Dote, Aki ; Kitada, Hideki ; Mizushima, Yoriko ; Nakamura, Tomoji ; Sakuyama, Seiki</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c341t-682d48679f423d79efef018f3aa3b8c009788a211f2ab7020294b97eef036503</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2016</creationdate><topic>Deformation</topic><topic>Dies</topic><topic>Equivalence</topic><topic>Mathematical analysis</topic><topic>Mathematical models</topic><topic>Modelling</topic><topic>Plate theory</topic><topic>Warpage</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Dote, Aki</creatorcontrib><creatorcontrib>Kitada, Hideki</creatorcontrib><creatorcontrib>Mizushima, Yoriko</creatorcontrib><creatorcontrib>Nakamura, Tomoji</creatorcontrib><creatorcontrib>Sakuyama, Seiki</creatorcontrib><collection>CrossRef</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Japanese Journal of Applied Physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Dote, Aki</au><au>Kitada, Hideki</au><au>Mizushima, Yoriko</au><au>Nakamura, Tomoji</au><au>Sakuyama, Seiki</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Analyzing and modeling methods for warpages of thin and large dies with redistribution layer</atitle><jtitle>Japanese Journal of Applied Physics</jtitle><addtitle>Jpn. J. Appl. Phys</addtitle><date>2016-06-01</date><risdate>2016</risdate><volume>55</volume><issue>6S3</issue><spage>6</spage><epage>06JC03</epage><pages>6-06JC03</pages><issn>0021-4922</issn><eissn>1347-4065</eissn><coden>JJAPB6</coden><abstract>Analyzing and modeling methods for warpages including cylindrical deformations are discussed in large-area dies with redistribution layers (RDLs) and thin 50-µm-thick Si substrates. The buckling behavior of warpage, a deformation transition from spherical to cylindrical, strongly depends on the lateral sizes of the dies and the RDL structures, and can be calculated using the analytical model of the nonlinear plate theory. The equivalent stress values are introduced to simplify RDL structures by applying the model to measured curvatures of homogeneous patterned samples. Area densities of Cu are a good index for evaluating die warpage even for inhomogeneous patterned RDLs.</abstract><pub>The Japan Society of Applied Physics</pub><doi>10.7567/JJAP.55.06JC03</doi><tpages>3</tpages></addata></record> |
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| ispartof | Japanese Journal of Applied Physics, 2016-06, Vol.55 (6S3), p.6-06JC03 |
| issn | 0021-4922 1347-4065 |
| language | eng |
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| source | Institute of Physics Journals; Institute of Physics (IOP) Journals - HEAL-Link |
| subjects | Deformation Dies Equivalence Mathematical analysis Mathematical models Modelling Plate theory Warpage |
| title | Analyzing and modeling methods for warpages of thin and large dies with redistribution layer |
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