Demonstrating 30-nm spatial resolution of three-multilayer-mirror objective for extreme ultraviolet microscopy: Imaging test by observing lithography mask

To confirm the high spatial resolution expected in extreme ultraviolet (EUV) microscopy, fine grating patterns with a half-pitch of less than 100 nm on a lithography mask were imaged using a full-field microscope based on a multilayer-mirror objective. When the tilted illumination technique is appli...

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Veröffentlicht in:Applied physics express 2014-10, Vol.7 (10), p.102502
Hauptverfasser: Toyoda, Mitsunori, Yamasoe, Kenjiro, Tokimasa, Akifumi, Uchida, Kentaro, Harada, Tetsuo, Terasawa, Tsuneo, Amano, Tsuyoshi, Watanabe, Takeo, Yanagihara, Mihiro, Kinoshita, Hiroo
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container_issue 10
container_start_page 102502
container_title Applied physics express
container_volume 7
creator Toyoda, Mitsunori
Yamasoe, Kenjiro
Tokimasa, Akifumi
Uchida, Kentaro
Harada, Tetsuo
Terasawa, Tsuneo
Amano, Tsuyoshi
Watanabe, Takeo
Yanagihara, Mihiro
Kinoshita, Hiroo
description To confirm the high spatial resolution expected in extreme ultraviolet (EUV) microscopy, fine grating patterns with a half-pitch of less than 100 nm on a lithography mask were imaged using a full-field microscope based on a multilayer-mirror objective. When the tilted illumination technique is applied to this novel imaging system, a spatial resolution better than 20 nm can be expected at a wavelength of 13.5 nm. We demonstrated high resolution via EUV reflection images of test patterns with a half-pitch between 30 and 80 nm.
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title Demonstrating 30-nm spatial resolution of three-multilayer-mirror objective for extreme ultraviolet microscopy: Imaging test by observing lithography mask
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