Fine Trace Substrate with 2 μm Fine Line for Advanced Package

Fine Trace Substrate with 2 μm Fine Line for Advanced Package

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Veröffentlicht in:TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2015, Vol.8 (1), p.18-22
Hauptverfasser: Hu, Dyi-Chung, Lin, Puru, Chen, Yu Hua
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container_title TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING
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creator Hu, Dyi-Chung
Lin, Puru
Chen, Yu Hua
description
doi_str_mv 10.5104/jiepeng.8.18
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title Fine Trace Substrate with 2 μm Fine Line for Advanced Package
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