Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding

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Veröffentlicht in:	TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2013, Vol.6 (1), p.38-42
Hauptverfasser:	Masumoto, Mutsumi, Arai, Yoshiyuki, Tomokage, Hajime
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Sprache:	eng
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title	Effect of Direction of Ultrasonic Vibration on Flip-Chip Bonding
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