Homogenizing and Applying Dielectric Film to Wafer-Level Film Preparation

Homogenizing and Applying Dielectric Film to Wafer-Level Film Preparation

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Veröffentlicht in:TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING 2012, Vol.5 (1), p.92-98
Hauptverfasser: Sueshige, Kazutaka, Iimura, Keita, Ichiki, Masaaki, Suga, Tadatomo, Itoh, Toshihiro
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container_title TRANSACTIONS OF THE JAPAN INSTITUTE OF ELECTRONICS PACKAGING
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creator Sueshige, Kazutaka
Iimura, Keita
Ichiki, Masaaki
Suga, Tadatomo
Itoh, Toshihiro
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doi_str_mv 10.5104/jiepeng.5.92
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title Homogenizing and Applying Dielectric Film to Wafer-Level Film Preparation
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