Compression Molding Technology for Powder/Granulated-Resin
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Veröffentlicht in: | Seikei kakou 2008/05/20, Vol.20(5), pp.279-283 |
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doi_str_mv | 10.4325/seikeikakou.20.279 |
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issn | 0915-4027 1883-7417 |
language | eng ; jpn |
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source | Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals; J-STAGE (Japan Science & Technology Information Aggregator, Electronic) Freely Available Titles - Japanese |
title | Compression Molding Technology for Powder/Granulated-Resin |
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