Effect of Fins Arrangement on Thermal Performance in Microelectronics Devices

Heat sink fins arrangement are important in heat management in microelectronics devices because it helps in the dissipation of heat from the chip level device to the environment and provide an efficiently working device. In this light, investigation was conducted on the effect of fins arrangement on...

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Veröffentlicht in:	Journal of Applied Sciences and Environmental Management 2019-02, Vol.22 (11), p.1797
1. Verfasser:	EKPU, M
Format:	Artikel
Sprache:	eng
Schlagworte:	fin arrangement heat transfer microelectronics
Online-Zugang:	Volltext
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