Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Immersion Tin-Lead Plating for Surface Mount Technology

Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Immersion Tin-Lead Plating for Surface Mount Technology

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Veröffentlicht in:Hyōmen gijutsu 1993, Vol.44 (7), p.605-608
Hauptverfasser: MIURA, Takeshi, KODAIRA, Shigeru
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container_end_page 608
container_issue 7
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container_title Hyōmen gijutsu
container_volume 44
creator MIURA, Takeshi
KODAIRA, Shigeru
description
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title Special Issue/Recent Trend and Future of Surface Finishing for Printed Wiring Boards Reviews. Immersion Tin-Lead Plating for Surface Mount Technology
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