Large Form Factor Hybrid LGA Interconnects; Recent Applications and Technical Learning

Recent high-end server design trends have continued to challenge electronic packaging engineers to design and integrate larger form factor land grid array (LGA) attached modules within their assemblies. These trends have included the application of larger, denser, organic packaged modules whose elec...

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Veröffentlicht in:	International Symposium on Microelectronics 2014-10, Vol.2014 (1), p.550-560
Hauptverfasser:	Torok, John, Beaman, Brian, Brodsky, William, Canfield, Shawn, Eagle, Jason, Lewis, Theron, Hoffmeyer, Mark, Sinha, Arvind, Yu, Yuet-Ying
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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