Assembly Equipment Requirements for Next Generation Advanced Packaging
Device packaging is undergoing a proliferation of assembly options within the ever-expanding category of Advanced Packaging. Fan Out-Wafer Level Packages are achieving wide adoption based on improved performance and reduced package size and new System in Package products are coming to market in FOWL...
Gespeichert in:
| Veröffentlicht in: | International Symposium on Microelectronics 2016-10, Vol.2016 (1), p.321-325 |
|---|---|
| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!