Evaluation about Solder-IMC Crack of Fine Pitch BGA Package
FBGA is widely adopted as AP and memory package for mobile devices such as a smart phone and a smart watch. FBGA is attached to PCB assembly during SMT process. Double side SMT is preferred to increase the battery area for slim design and long life of mobile device. Solder-IMC crack is in-process re...
Gespeichert in:
| Veröffentlicht in: | International Symposium on Microelectronics 2015-10, Vol.2015 (1), p.147-150 |
|---|---|
| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!