Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures
Methods for investigations of stresses specialized for devices operating up to 500 °C are presented in this study. Resistive pressure sensors and test-chips with micro strain gauges are processed in thin film technology. The sensor structure was a wheatstone-bridge on a silicon membrane with platinu...
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| Veröffentlicht in: | International Symposium on Microelectronics 2013-01, Vol.2013 (1), p.723-728 |
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| Hauptverfasser: | , , , , |
| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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