Reliability Assessment of Flip-Chip Assembly of Al Bumps

This article reports on a flip-chip bonding technology using an Al bump at high temperatures, such as for SiC semiconductors. In recent years, double-sided mounting structures have been proposed for purposes of miniaturization and low inductance. The surface-mounting method requires durability again...

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Veröffentlicht in:	Journal of microelectronics and electronic packaging 2015-08, Vol.12 (2), p.92-97
Hauptverfasser:	Tanisawa, Hidekazu, Hiyama, Kohei, Anzai, Takeshi, Takahashi, Hiroki, Murakami, Yoshinori, Sato, Shinji, Watanabe, Kinuyo, Kato, Fumiki, Sato, Hiroshi
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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