Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability

This paper comprehensively describes the fabrication method and shear strength reliability of a eutectic Zn-Al (m.p. = 382°C) attachment system, built by soldering SiC dice (2 × 2 mm2) onto Cu foil active-metal-brazed with a SiN ceramic plate. Four essential soldering conditions are presented and di...

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Veröffentlicht in:	Journal of microelectronics and electronic packaging 2013-04, Vol.10 (2), p.59-66
Hauptverfasser:	TANIMOTO, Satoshi, MATSUI, Kohei, ZUSHI, Yusuke, SATO, Shinji, MURAKAMI, Yoshinori, TAKAMORI, Masato, ISEKI, Takashi
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Design. Technologies. Operation analysis. Testing Electrical engineering. Electrical power engineering Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Integrated circuits Power electronics, power supplies Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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