Microstructural Characterization of Sn57Bi1Ag Solder Alloy Joints

Sn57Bi1Ag alloy system meets the basic solderability requirements while reliability of solder is less known. The presence of intermetallics that form at the solder-joint interface and in the bulk solder is the primary reason to cause joint failure on simple loading. Furthermore, dissolution of solde...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	IMAPSource Proceedings 2023-05, Vol.2022 (IMAPS Symposium)
Hauptverfasser:	Murali, Sarangapani, Evonne, Lim Yee Weon, Wan, Lo Miew, Danila, Bayaras Abito, Keong, Loke Chee, Ting, Lo Yee, Kumar, Balasubramanian Senthil, Sungsig SS, Kang
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!