The Study of Highest Thickness Photo Resist for Cu Post of Fan-Out Wafer Level Packaging

The mobile device’s limited thermal budget hardly allows the use of a high-performance application (AP) at its full speed. However, as artificial intelligence technologies has been rapidly applied for mobile devices, the demand like high-speed and large-capacity signal processing is continuously inc...

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Veröffentlicht in:	IMAPSource Proceedings 2023-05, Vol.2022 (IMAPS Symposium)
Hauptverfasser:	Heo, Yuseon, Lee, Jiyoung, Park, Jieun, Park, Junhyeong, Shim, Jihye, Kim, Sueryeon
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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