Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding Reliability

Copper (Cu) wire bonding, with its advantages of higher electrical conductivity and better mechanical strength, has replaced gold wire bonding as a proven, cost-effective electrical interconnection solution for integrated circuit packaging for the past 15 y. Early Cu wire-bonding development require...

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Veröffentlicht in:	Journal of microelectronics and electronic packaging 2024-04, Vol.21 (2)
Hauptverfasser:	Durai, Kevin Antony Jesu, Kumaravel, Dinesh Kumar, Alptekin, John, Estridge, Logan, Nair, Shyam, Chyan, Oliver
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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