Planar heating chuck to improve temperature uniformity of plasma processing equipment
Semiconductor fabrication has increasingly demanded improved control of process parameters related to equipment temperature, such as heating and cooling speed and temperature uniformity of the wafer chuck. We perform preliminary thermal-electrical analysis of a heating chuck with a planar heating el...
Gespeichert in:
| Veröffentlicht in: | Japanese Journal of Applied Physics 2020-06, Vol.59 (SJ), p.SJJD01 |
|---|---|
| Hauptverfasser: | , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | SJ |
| container_start_page | SJJD01 |
| container_title | Japanese Journal of Applied Physics |
| container_volume | 59 |
| creator | Im, Dong-Hyeok Min, Woo-Sig Hong, Sang-Jeen |
| description | Semiconductor fabrication has increasingly demanded improved control of process parameters related to equipment temperature, such as heating and cooling speed and temperature uniformity of the wafer chuck. We perform preliminary thermal-electrical analysis of a heating chuck with a planar heating element, to investigate the feasibility of a planar heating element for plasma-assisted deposition equipment. We propose and optimize circular electrode patterns for the planar heating element of a 6 inch heating chuck design to improve temperature uniformity of the wafer chuck. Using an Analysis System numerical study, we achieve a superior temperature uniformity profile compared to conventional coil-type heating elements. |
| doi_str_mv | 10.35848/1347-4065/ab840d |
| format | Article |
| fullrecord | <record><control><sourceid>iop_cross</sourceid><recordid>TN_cdi_crossref_primary_10_35848_1347_4065_ab840d</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>jjapab840d</sourcerecordid><originalsourceid>FETCH-LOGICAL-c383t-e0cceccd1e3bb9f9fdc912db7ed44f2081115ee19a122e452b680cdf5a6499703</originalsourceid><addsrcrecordid>eNp1kN1LwzAUxYMoOD_-AN_y6kNdkiZd8yjzcwwUdM8hTW9c6trGJBX239s58UnhwuVezjkcfghdUHKVi5KXU5rzWcZJIaa6KjmpD9Dk93WIJoQwmnHJ2DE6ibEZz0JwOkGr543udMBr0Ml1b9isB_OOU49d60P_CThB6yHoNATAQ-dsH1qXtri32G90bDUeZQZi3JnhY3C-hS6doSOrNxHOf_YpWt3dvs4fsuXT_eP8epmZvMxTBsQYMKamkFeVtNLWRlJWVzOoObeMlJRSAUClpowBF6wqSmJqK3TBpZyR_BTRfa4JfYwBrPLBtTpsFSXqm4vaQVA7CGrPZfRc7j2u96rph9CNDVXTaK-EVC-LcRY3hCpf21Gb_aH9P_sLVod1TA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Planar heating chuck to improve temperature uniformity of plasma processing equipment</title><source>IOP Publishing Journals</source><source>Institute of Physics (IOP) Journals - HEAL-Link</source><creator>Im, Dong-Hyeok ; Min, Woo-Sig ; Hong, Sang-Jeen</creator><creatorcontrib>Im, Dong-Hyeok ; Min, Woo-Sig ; Hong, Sang-Jeen</creatorcontrib><description>Semiconductor fabrication has increasingly demanded improved control of process parameters related to equipment temperature, such as heating and cooling speed and temperature uniformity of the wafer chuck. We perform preliminary thermal-electrical analysis of a heating chuck with a planar heating element, to investigate the feasibility of a planar heating element for plasma-assisted deposition equipment. We propose and optimize circular electrode patterns for the planar heating element of a 6 inch heating chuck design to improve temperature uniformity of the wafer chuck. Using an Analysis System numerical study, we achieve a superior temperature uniformity profile compared to conventional coil-type heating elements.</description><identifier>ISSN: 0021-4922</identifier><identifier>EISSN: 1347-4065</identifier><identifier>DOI: 10.35848/1347-4065/ab840d</identifier><identifier>CODEN: JJAPB6</identifier><language>eng</language><publisher>IOP Publishing</publisher><subject>3D modeling ; heating chuck ; temperature uniformity</subject><ispartof>Japanese Journal of Applied Physics, 2020-06, Vol.59 (SJ), p.SJJD01</ispartof><rights>2020 The Japan Society of Applied Physics</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c383t-e0cceccd1e3bb9f9fdc912db7ed44f2081115ee19a122e452b680cdf5a6499703</citedby><cites>FETCH-LOGICAL-c383t-e0cceccd1e3bb9f9fdc912db7ed44f2081115ee19a122e452b680cdf5a6499703</cites><orcidid>0000-0002-6576-690X ; 0000-0003-1421-3421 ; 0000-0002-3315-4175</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://iopscience.iop.org/article/10.35848/1347-4065/ab840d/pdf$$EPDF$$P50$$Giop$$H</linktopdf><link.rule.ids>314,780,784,27923,27924,53845,53892</link.rule.ids></links><search><creatorcontrib>Im, Dong-Hyeok</creatorcontrib><creatorcontrib>Min, Woo-Sig</creatorcontrib><creatorcontrib>Hong, Sang-Jeen</creatorcontrib><title>Planar heating chuck to improve temperature uniformity of plasma processing equipment</title><title>Japanese Journal of Applied Physics</title><addtitle>Jpn. J. Appl. Phys</addtitle><description>Semiconductor fabrication has increasingly demanded improved control of process parameters related to equipment temperature, such as heating and cooling speed and temperature uniformity of the wafer chuck. We perform preliminary thermal-electrical analysis of a heating chuck with a planar heating element, to investigate the feasibility of a planar heating element for plasma-assisted deposition equipment. We propose and optimize circular electrode patterns for the planar heating element of a 6 inch heating chuck design to improve temperature uniformity of the wafer chuck. Using an Analysis System numerical study, we achieve a superior temperature uniformity profile compared to conventional coil-type heating elements.</description><subject>3D modeling</subject><subject>heating chuck</subject><subject>temperature uniformity</subject><issn>0021-4922</issn><issn>1347-4065</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2020</creationdate><recordtype>article</recordtype><recordid>eNp1kN1LwzAUxYMoOD_-AN_y6kNdkiZd8yjzcwwUdM8hTW9c6trGJBX239s58UnhwuVezjkcfghdUHKVi5KXU5rzWcZJIaa6KjmpD9Dk93WIJoQwmnHJ2DE6ibEZz0JwOkGr543udMBr0Ml1b9isB_OOU49d60P_CThB6yHoNATAQ-dsH1qXtri32G90bDUeZQZi3JnhY3C-hS6doSOrNxHOf_YpWt3dvs4fsuXT_eP8epmZvMxTBsQYMKamkFeVtNLWRlJWVzOoObeMlJRSAUClpowBF6wqSmJqK3TBpZyR_BTRfa4JfYwBrPLBtTpsFSXqm4vaQVA7CGrPZfRc7j2u96rph9CNDVXTaK-EVC-LcRY3hCpf21Gb_aH9P_sLVod1TA</recordid><startdate>20200601</startdate><enddate>20200601</enddate><creator>Im, Dong-Hyeok</creator><creator>Min, Woo-Sig</creator><creator>Hong, Sang-Jeen</creator><general>IOP Publishing</general><scope>AAYXX</scope><scope>CITATION</scope><orcidid>https://orcid.org/0000-0002-6576-690X</orcidid><orcidid>https://orcid.org/0000-0003-1421-3421</orcidid><orcidid>https://orcid.org/0000-0002-3315-4175</orcidid></search><sort><creationdate>20200601</creationdate><title>Planar heating chuck to improve temperature uniformity of plasma processing equipment</title><author>Im, Dong-Hyeok ; Min, Woo-Sig ; Hong, Sang-Jeen</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c383t-e0cceccd1e3bb9f9fdc912db7ed44f2081115ee19a122e452b680cdf5a6499703</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2020</creationdate><topic>3D modeling</topic><topic>heating chuck</topic><topic>temperature uniformity</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Im, Dong-Hyeok</creatorcontrib><creatorcontrib>Min, Woo-Sig</creatorcontrib><creatorcontrib>Hong, Sang-Jeen</creatorcontrib><collection>CrossRef</collection><jtitle>Japanese Journal of Applied Physics</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Im, Dong-Hyeok</au><au>Min, Woo-Sig</au><au>Hong, Sang-Jeen</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Planar heating chuck to improve temperature uniformity of plasma processing equipment</atitle><jtitle>Japanese Journal of Applied Physics</jtitle><addtitle>Jpn. J. Appl. Phys</addtitle><date>2020-06-01</date><risdate>2020</risdate><volume>59</volume><issue>SJ</issue><spage>SJJD01</spage><pages>SJJD01-</pages><issn>0021-4922</issn><eissn>1347-4065</eissn><coden>JJAPB6</coden><abstract>Semiconductor fabrication has increasingly demanded improved control of process parameters related to equipment temperature, such as heating and cooling speed and temperature uniformity of the wafer chuck. We perform preliminary thermal-electrical analysis of a heating chuck with a planar heating element, to investigate the feasibility of a planar heating element for plasma-assisted deposition equipment. We propose and optimize circular electrode patterns for the planar heating element of a 6 inch heating chuck design to improve temperature uniformity of the wafer chuck. Using an Analysis System numerical study, we achieve a superior temperature uniformity profile compared to conventional coil-type heating elements.</abstract><pub>IOP Publishing</pub><doi>10.35848/1347-4065/ab840d</doi><tpages>8</tpages><orcidid>https://orcid.org/0000-0002-6576-690X</orcidid><orcidid>https://orcid.org/0000-0003-1421-3421</orcidid><orcidid>https://orcid.org/0000-0002-3315-4175</orcidid></addata></record> |
| fulltext | fulltext |
| identifier | ISSN: 0021-4922 |
| ispartof | Japanese Journal of Applied Physics, 2020-06, Vol.59 (SJ), p.SJJD01 |
| issn | 0021-4922 1347-4065 |
| language | eng |
| recordid | cdi_crossref_primary_10_35848_1347_4065_ab840d |
| source | IOP Publishing Journals; Institute of Physics (IOP) Journals - HEAL-Link |
| subjects | 3D modeling heating chuck temperature uniformity |
| title | Planar heating chuck to improve temperature uniformity of plasma processing equipment |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-08T21%3A33%3A17IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-iop_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Planar%20heating%20chuck%20to%20improve%20temperature%20uniformity%20of%20plasma%20processing%20equipment&rft.jtitle=Japanese%20Journal%20of%20Applied%20Physics&rft.au=Im,%20Dong-Hyeok&rft.date=2020-06-01&rft.volume=59&rft.issue=SJ&rft.spage=SJJD01&rft.pages=SJJD01-&rft.issn=0021-4922&rft.eissn=1347-4065&rft.coden=JJAPB6&rft_id=info:doi/10.35848/1347-4065/ab840d&rft_dat=%3Ciop_cross%3Ejjapab840d%3C/iop_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |