Geometrical Effects on Ultrasonic Al Bump Direct Bonding for Microsystem Integration: Simulation and Experiments

This study employed finite element analysis to simulate ultrasonic metal bump direct bonding. The stress distribution on bonding interfaces in metal bump arrays made of Al, Cu, and Ni/Pd/Au was simulated by adjusting geometrical parameters of the bumps, including the shape, size, and height; the bon...

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Veröffentlicht in:	Micromachines (Basel) 2021-06, Vol.12 (7), p.750
Hauptverfasser:	Lee, Jun-Hao, Li, Pin-Kuan, Hung, Hai-Wen, Chuang, Wallace, Schellkes, Eckart, Yasuda, Kiyokazu, Song, Jenn-Ming
Format:	Artikel
Sprache:	eng
Schlagworte:	Aluminum Argon plasma Arrays Bonded joints Bonding strength Contact angle Copper Finite element analysis Finite element method Friction Gold Intermetallic compounds Lithography metal direct bonding Microelectromechanical systems microsystem integration Nickel Palladium Shear strength Shear tests Silicon Simulation Stress concentration Stress distribution ultrasonic bonding Ultrasonic vibration
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