Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing
Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morphology were investigated. The thermal evaporation of...
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| Veröffentlicht in: | Materials 2021-10, Vol.14 (21), p.6269, Article 6269 |
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| creator | Kozlowski, Pawel Czuba, Krzysztof Chmielewski, Krzysztof Ratajczak, Jacek Branas, Joanna Korczyc, Adam Reginski, Kazimierz Jasik, Agata |
| description | Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morphology were investigated. The thermal evaporation of indium has been optimized to achieve similar to 8 mu m-thick layers with a small surface roughness of R-a = 11 nm, indicating a high packing density of atoms. This ensures bump uniformity across the sample, as well as prevents oxidation inside the In columns prior to the reflow. A series of experiments to optimize indium bump fabrication technology, including a shear test of single columns, is described. A reliable, repeatable, simple, and quick approach was developed with the pre-etching of indium columns in a 10% HCl solution preceded by annealing at 120 degrees C in N-2. |
| doi_str_mv | 10.3390/ma14216269 |
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In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morphology were investigated. The thermal evaporation of indium has been optimized to achieve similar to 8 mu m-thick layers with a small surface roughness of R-a = 11 nm, indicating a high packing density of atoms. This ensures bump uniformity across the sample, as well as prevents oxidation inside the In columns prior to the reflow. A series of experiments to optimize indium bump fabrication technology, including a shear test of single columns, is described. A reliable, repeatable, simple, and quick approach was developed with the pre-etching of indium columns in a 10% HCl solution preceded by annealing at 120 degrees C in N-2.</description><identifier>ISSN: 1996-1944</identifier><identifier>EISSN: 1996-1944</identifier><identifier>DOI: 10.3390/ma14216269</identifier><identifier>PMID: 34771804</identifier><language>eng</language><publisher>BASEL: Mdpi</publisher><subject>Annealing ; Arrays ; Chemistry ; Chemistry, Physical ; Etching ; Focal plane devices ; Hydrochloric acid ; Indium ; Materials Science ; Materials Science, Multidisciplinary ; Metallurgy & Metallurgical Engineering ; Morphology ; Oxidation ; Packing density ; Physical Sciences ; Physics ; Physics, Applied ; Physics, Condensed Matter ; Plasma etching ; Science & Technology ; Semiconductors ; Sensors ; Shear tests ; Spectrum analysis ; Surface roughness ; Technology ; Thermal cycling</subject><ispartof>Materials, 2021-10, Vol.14 (21), p.6269, Article 6269</ispartof><rights>2021 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (https://creativecommons.org/licenses/by/4.0/). Notwithstanding the ProQuest Terms and Conditions, you may use this content in accordance with the terms of the License.</rights><rights>2021 by the authors. 2021</rights><lds50>peer_reviewed</lds50><oa>free_for_read</oa><woscitedreferencessubscribed>true</woscitedreferencessubscribed><woscitedreferencescount>3</woscitedreferencescount><woscitedreferencesoriginalsourcerecordid>wos000718406400001</woscitedreferencesoriginalsourcerecordid><citedby>FETCH-LOGICAL-c383t-6d45790782f94127f40c1e185d9f79524c49f7bb79f4a20f86978c9a73909a013</citedby><cites>FETCH-LOGICAL-c383t-6d45790782f94127f40c1e185d9f79524c49f7bb79f4a20f86978c9a73909a013</cites><orcidid>0000-0002-0331-0456 ; 0000-0003-4051-499X ; 0000-0002-6704-7810</orcidid></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC8584861/pdf/$$EPDF$$P50$$Gpubmedcentral$$Hfree_for_read</linktopdf><linktohtml>$$Uhttps://www.ncbi.nlm.nih.gov/pmc/articles/PMC8584861/$$EHTML$$P50$$Gpubmedcentral$$Hfree_for_read</linktohtml><link.rule.ids>230,315,728,781,785,886,27929,27930,39263,53796,53798</link.rule.ids></links><search><creatorcontrib>Kozlowski, Pawel</creatorcontrib><creatorcontrib>Czuba, Krzysztof</creatorcontrib><creatorcontrib>Chmielewski, Krzysztof</creatorcontrib><creatorcontrib>Ratajczak, Jacek</creatorcontrib><creatorcontrib>Branas, Joanna</creatorcontrib><creatorcontrib>Korczyc, Adam</creatorcontrib><creatorcontrib>Reginski, Kazimierz</creatorcontrib><creatorcontrib>Jasik, Agata</creatorcontrib><title>Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing</title><title>Materials</title><addtitle>MATERIALS</addtitle><description>Indium-based micro-bump arrays, among other things, are used for the bonding of infrared photodetectors and focal plane arrays. 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A reliable, repeatable, simple, and quick approach was developed with the pre-etching of indium columns in a 10% HCl solution preceded by annealing at 120 degrees C in N-2.</description><subject>Annealing</subject><subject>Arrays</subject><subject>Chemistry</subject><subject>Chemistry, Physical</subject><subject>Etching</subject><subject>Focal plane devices</subject><subject>Hydrochloric acid</subject><subject>Indium</subject><subject>Materials Science</subject><subject>Materials Science, Multidisciplinary</subject><subject>Metallurgy & Metallurgical Engineering</subject><subject>Morphology</subject><subject>Oxidation</subject><subject>Packing density</subject><subject>Physical Sciences</subject><subject>Physics</subject><subject>Physics, Applied</subject><subject>Physics, Condensed Matter</subject><subject>Plasma etching</subject><subject>Science & Technology</subject><subject>Semiconductors</subject><subject>Sensors</subject><subject>Shear tests</subject><subject>Spectrum analysis</subject><subject>Surface roughness</subject><subject>Technology</subject><subject>Thermal cycling</subject><issn>1996-1944</issn><issn>1996-1944</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2021</creationdate><recordtype>article</recordtype><sourceid>HGBXW</sourceid><sourceid>ABUWG</sourceid><sourceid>AFKRA</sourceid><sourceid>AZQEC</sourceid><sourceid>BENPR</sourceid><sourceid>CCPQU</sourceid><sourceid>DWQXO</sourceid><recordid>eNqNkV1rFDEUhoMottTe-AsC3ogymkwy-bgRtkurhYoiFS9DJsnspswka5Jx2X9vxi3148rc5BzyvC8n5wXgOUZvCJHo7aQxbTFrmXwETrGUrMGS0sd_1CfgPOc7VA8hWLTyKTghlHMsED0F9jpYP0_Nhc7Owo_epNhczNMOrlLSB3il--SNLj4GeOvMNsQxbg5w78sWrqytks_JNV_cMMY9_OYKvCxm68MG6mDhKgSnx9o9A08GPWZ3fn-fga9Xl7frD83Np_fX69VNY4ggpWGWdlwiLtpBUtzygSKDHRadlQOXXUsNrUXfczlQ3aJBMMmFkZrXPUiNMDkD746-u7mfnDUulKRHtUt-0umgovbq75fgt2oTfyjRCSrYYvDy3iDF77PLRU0-GzeOOrg4Z9V2ktNlkq6iL_5B7-KcQv3eQjHUdYzSSr06UnWvOSc3PAyDkVryU7_zq7A4wnvXxyEb74JxD4KaX82MIkaXKPHal1-xrOMcSpW-_n8p-QlfLKrV</recordid><startdate>20211021</startdate><enddate>20211021</enddate><creator>Kozlowski, Pawel</creator><creator>Czuba, Krzysztof</creator><creator>Chmielewski, Krzysztof</creator><creator>Ratajczak, Jacek</creator><creator>Branas, Joanna</creator><creator>Korczyc, Adam</creator><creator>Reginski, Kazimierz</creator><creator>Jasik, Agata</creator><general>Mdpi</general><general>MDPI AG</general><general>MDPI</general><scope>BLEPL</scope><scope>DTL</scope><scope>HGBXW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>7SR</scope><scope>8FD</scope><scope>8FE</scope><scope>8FG</scope><scope>ABJCF</scope><scope>ABUWG</scope><scope>AFKRA</scope><scope>AZQEC</scope><scope>BENPR</scope><scope>BGLVJ</scope><scope>CCPQU</scope><scope>D1I</scope><scope>DWQXO</scope><scope>HCIFZ</scope><scope>JG9</scope><scope>KB.</scope><scope>PDBOC</scope><scope>PIMPY</scope><scope>PQEST</scope><scope>PQQKQ</scope><scope>PQUKI</scope><scope>PRINS</scope><scope>7X8</scope><scope>5PM</scope><orcidid>https://orcid.org/0000-0002-0331-0456</orcidid><orcidid>https://orcid.org/0000-0003-4051-499X</orcidid><orcidid>https://orcid.org/0000-0002-6704-7810</orcidid></search><sort><creationdate>20211021</creationdate><title>Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing</title><author>Kozlowski, Pawel ; 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In this paper, several aspects of the fabrication technology of micrometer-sized indium bumps with a smooth surface morphology were investigated. The thermal evaporation of indium has been optimized to achieve similar to 8 mu m-thick layers with a small surface roughness of R-a = 11 nm, indicating a high packing density of atoms. This ensures bump uniformity across the sample, as well as prevents oxidation inside the In columns prior to the reflow. A series of experiments to optimize indium bump fabrication technology, including a shear test of single columns, is described. 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| subjects | Annealing Arrays Chemistry Chemistry, Physical Etching Focal plane devices Hydrochloric acid Indium Materials Science Materials Science, Multidisciplinary Metallurgy & Metallurgical Engineering Morphology Oxidation Packing density Physical Sciences Physics Physics, Applied Physics, Condensed Matter Plasma etching Science & Technology Semiconductors Sensors Shear tests Spectrum analysis Surface roughness Technology Thermal cycling |
| title | Indium-Based Micro-Bump Array Fabrication Technology with Added Pre-Reflow Wet Etching and Annealing |
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