Outgassing Characteristics of Electroless Plated Epoxy Resin

Outgassing Characteristics of Electroless Plated Epoxy Resin

Outgassing rate of an epoxy resin is the most important property in application of an epoxy resin for semiconductor processing in a high vacuum environment. Main desorbed gases is H2O from the surface and the inside of the epoxy resin. Electroless plating process was improved by Cu and Ni plating an...

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Veröffentlicht in:SHINKU 2002/03/20, Vol.45(3), pp.142-144
Hauptverfasser: OTA, Nobuhiko, HAMAO, Toshikazu
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HAMAO, Toshikazu
description Outgassing rate of an epoxy resin is the most important property in application of an epoxy resin for semiconductor processing in a high vacuum environment. Main desorbed gases is H2O from the surface and the inside of the epoxy resin. Electroless plating process was improved by Cu and Ni plating and the impregnation of the epoxy resin on pre-etching process. Outgassing rate of the epoxy resin plated Cu and Ni layer was two orders of magnitude smaller than that of nonplated epoxy resin.
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fullrecord <record><control><sourceid>jstage_cross</sourceid><recordid>TN_cdi_crossref_primary_10_3131_jvsj_45_142</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>article_jvsj1958_45_3_45_3_142_article_char_en</sourcerecordid><originalsourceid>FETCH-LOGICAL-c2592-428e50eaa266f8bb027bed619d4c7c4cc6c20d8f3ef43accbc82df2b888dea1d3</originalsourceid><addsrcrecordid>eNo9kE1Lw0AQhhdRsNSe_AO5S-p-phvwIjVWoVARPS-b2dmYEpuyG8X-ezdWepmBmecdeIaQa0bnggl2u_2O27lUcyb5GZkwrWleSibOyYQqVeZaseKSzGJsayqEpFRJNSF3m6-hsWm4a7Llhw0WBgxtHFqIWe-zqkMYQt9hjNlLZwd0WbXvfw7ZK6bIFbnwtos4--9T8v5YvS2f8vVm9by8X-fAVclzyTUqitbyovC6rilf1OgKVjoJC5AABXDqtBfopbAANWjuPK-11g4tc2JKbo53IfQxBvRmH9pPGw6GUTO6m9HdSGWSe6IfjvQ2DrbBE2tDsurwj2Wl0iMvjiXFTmtIXzC4E78FnmbO</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Outgassing Characteristics of Electroless Plated Epoxy Resin</title><source>J-STAGE Free</source><creator>OTA, Nobuhiko ; HAMAO, Toshikazu</creator><creatorcontrib>OTA, Nobuhiko ; HAMAO, Toshikazu</creatorcontrib><description>Outgassing rate of an epoxy resin is the most important property in application of an epoxy resin for semiconductor processing in a high vacuum environment. Main desorbed gases is H2O from the surface and the inside of the epoxy resin. Electroless plating process was improved by Cu and Ni plating and the impregnation of the epoxy resin on pre-etching process. Outgassing rate of the epoxy resin plated Cu and Ni layer was two orders of magnitude smaller than that of nonplated epoxy resin.</description><identifier>ISSN: 0559-8516</identifier><identifier>EISSN: 1880-9413</identifier><identifier>DOI: 10.3131/jvsj.45.142</identifier><language>eng ; jpn</language><publisher>The Vacuum Society of Japan</publisher><ispartof>Shinku, 2002/03/20, Vol.45(3), pp.142-144</ispartof><rights>The Vacuum Society of Japan</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,1877,4010,27900,27901,27902</link.rule.ids></links><search><creatorcontrib>OTA, Nobuhiko</creatorcontrib><creatorcontrib>HAMAO, Toshikazu</creatorcontrib><title>Outgassing Characteristics of Electroless Plated Epoxy Resin</title><title>SHINKU</title><addtitle>J. Vac. Soc. Jpn.</addtitle><description>Outgassing rate of an epoxy resin is the most important property in application of an epoxy resin for semiconductor processing in a high vacuum environment. Main desorbed gases is H2O from the surface and the inside of the epoxy resin. Electroless plating process was improved by Cu and Ni plating and the impregnation of the epoxy resin on pre-etching process. Outgassing rate of the epoxy resin plated Cu and Ni layer was two orders of magnitude smaller than that of nonplated epoxy resin.</description><issn>0559-8516</issn><issn>1880-9413</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2002</creationdate><recordtype>article</recordtype><recordid>eNo9kE1Lw0AQhhdRsNSe_AO5S-p-phvwIjVWoVARPS-b2dmYEpuyG8X-ezdWepmBmecdeIaQa0bnggl2u_2O27lUcyb5GZkwrWleSibOyYQqVeZaseKSzGJsayqEpFRJNSF3m6-hsWm4a7Llhw0WBgxtHFqIWe-zqkMYQt9hjNlLZwd0WbXvfw7ZK6bIFbnwtos4--9T8v5YvS2f8vVm9by8X-fAVclzyTUqitbyovC6rilf1OgKVjoJC5AABXDqtBfopbAANWjuPK-11g4tc2JKbo53IfQxBvRmH9pPGw6GUTO6m9HdSGWSe6IfjvQ2DrbBE2tDsurwj2Wl0iMvjiXFTmtIXzC4E78FnmbO</recordid><startdate>2002</startdate><enddate>2002</enddate><creator>OTA, Nobuhiko</creator><creator>HAMAO, Toshikazu</creator><general>The Vacuum Society of Japan</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>2002</creationdate><title>Outgassing Characteristics of Electroless Plated Epoxy Resin</title><author>OTA, Nobuhiko ; HAMAO, Toshikazu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2592-428e50eaa266f8bb027bed619d4c7c4cc6c20d8f3ef43accbc82df2b888dea1d3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng ; jpn</language><creationdate>2002</creationdate><toplevel>online_resources</toplevel><creatorcontrib>OTA, Nobuhiko</creatorcontrib><creatorcontrib>HAMAO, Toshikazu</creatorcontrib><collection>CrossRef</collection><jtitle>SHINKU</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>OTA, Nobuhiko</au><au>HAMAO, Toshikazu</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Outgassing Characteristics of Electroless Plated Epoxy Resin</atitle><jtitle>SHINKU</jtitle><addtitle>J. Vac. Soc. Jpn.</addtitle><date>2002</date><risdate>2002</risdate><volume>45</volume><issue>3</issue><spage>142</spage><epage>144</epage><pages>142-144</pages><issn>0559-8516</issn><eissn>1880-9413</eissn><abstract>Outgassing rate of an epoxy resin is the most important property in application of an epoxy resin for semiconductor processing in a high vacuum environment. Main desorbed gases is H2O from the surface and the inside of the epoxy resin. Electroless plating process was improved by Cu and Ni plating and the impregnation of the epoxy resin on pre-etching process. Outgassing rate of the epoxy resin plated Cu and Ni layer was two orders of magnitude smaller than that of nonplated epoxy resin.</abstract><pub>The Vacuum Society of Japan</pub><doi>10.3131/jvsj.45.142</doi><tpages>3</tpages><oa>free_for_read</oa></addata></record>
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title Outgassing Characteristics of Electroless Plated Epoxy Resin
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-03T16%3A49%3A48IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-jstage_cross&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Outgassing%20Characteristics%20of%20Electroless%20Plated%20Epoxy%20Resin&rft.jtitle=SHINKU&rft.au=OTA,%20Nobuhiko&rft.date=2002&rft.volume=45&rft.issue=3&rft.spage=142&rft.epage=144&rft.pages=142-144&rft.issn=0559-8516&rft.eissn=1880-9413&rft_id=info:doi/10.3131/jvsj.45.142&rft_dat=%3Cjstage_cross%3Earticle_jvsj1958_45_3_45_3_142_article_char_en%3C/jstage_cross%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true