Recent Trend of Advanced LSI Packaging: Introduction for application of polymers

Recent trends in Advanced LSI Packaging for heterogeneous integration are described. 2D package also called MCM (Multi Chip Module), FOWLP (Fan-Out Wafer Level Packaging) which has been applied to smartphones, 2.5D package using silicon chip as an interposer, chip embedded package which compensates for the shortcomings of the 2D and 2.5D package, and the 3D package which has recently gained great attention, are discussed. While it is becoming more difficult to improve performance by shrinkage of critical feature size and scaling rules, the proposed the concept of chiplets has led package technology to play a role in further improving the performance of LSIs.