Relationship between Slurry Actions in Slicing Groove and Slicing Characteristics at Multi-Wire Saw

The multi-wire saw is one of the methods used to slice large-sized silicon ingots. This slicing method uses a working fluid mixed abrasive grains, which is called slurry. In the case of a multi-wire saw of the workpiece descent-type, this slurry is supplied on the wire and carried to the processing...

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Veröffentlicht in:	Journal of the Japan Society for Precision Engineering 2003/12/05, Vol.69(12), pp.1739-1743
Hauptverfasser:	ISHIKAWA, Ken-Ichi, SUWABE, Hitoshi, ITOH, Shun-Ichi
Format:	Artikel
Sprache:	jpn
Schlagworte:	lapping multi-wire saw slicing slurry action
Online-Zugang:	Volltext
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